Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model

Author(s):  
Wei-Yao Chang ◽  
Hsiang-Chen Hsu ◽  
Shen-Li Fu ◽  
Chang-Lin Yeh ◽  
Yi-Shao Lai
1991 ◽  
Vol 226 ◽  
Author(s):  
Tomohiro Uno ◽  
K. Tatsumi ◽  
K. Mizuno ◽  
O. Kitamura ◽  
Y. Ohno

AbstractA comparison was made of gold and copper wires used in ball bonding in terms of their mechanical properties, bondability and the reliability of their bond interfaces in elevated temperature environments. The ball bondability of copper and gold was evaluated through clarification of the factors which govern ball deformability. Moreover a bonding method to suppress the generation of silicon cracks was proposed for ball bonding of copper wire. As to the reliability of the heat affected zone and the bond interfaces, copper wire was found to be superior to gold wire.


2014 ◽  
Vol 931-932 ◽  
pp. 994-998
Author(s):  
Rangsan Wannapop ◽  
Thira Jearsiripongkul ◽  
Thawatchai Boonluang

This research represents a design and analysis of Automatic loading copper wire machine for the actuator arm (ALCM). The process of copper wire placement on a single actuator arm type compensates human workers. In this research, copper wire placement set is made as a 3D model by computer program before undergoes arrangement analysis via explicit dynamic finite element method to study a suitable speed for copper wire placing. It is considered by characteristics of copper wire after placed and failures occurred during the process that will define suitable speed of motor rotation. The suitable speed is corresponding to copper wire characteristic as preferred, prevent copper wire fracture and time reduction compare to human work.


2015 ◽  
Vol 137 (1) ◽  
Author(s):  
Fuliang Wang ◽  
Dengke Fan

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.


2016 ◽  
Vol 64 (2) ◽  
pp. 425-434 ◽  
Author(s):  
M. Jafari Vardanjani ◽  
A. Araee ◽  
J. Senkara ◽  
J. Jakubowski ◽  
J. Godek

Abstract Few aspects of shunting effect have been studied so far. Shunting effect in resistance spot welding (RSW) occurs when the electrical current passes through the previous spot welds. Value of this current depends mostly on distance, number, and size of previous spot welds. This will cause some dimensional and metallurgical changes in welding nugget as well as heat affected zone (HAZ). In this study, shunting effect of RSW is considered by finite element method (FEM) and the results are compared to experiments performed on aluminum alloy 2219. Weld spacing together with welding current and time are considered to discover the effect of shunting current in the final quality of nugget. A three factor experiment design has been performed to find the significance of factors and interactive effects, as well as finite element model verification. Electrothermal and mechanical interactions are considered in the FEM. Experimental and numerical solutions have yielded similar results in terms of welding nugget properties. Asymmetry in electrical potential, temperature, stress distribution and geometry of shunted nugget is predicted and verified directly or indirectly. Intense effect of shunting current on nugget height, asymmetric growth of heat affected zone (HAZ) toward previous welding nugget, as well as concentration of alloying elements along grain boundaries are also discovered.


2012 ◽  
Vol 622-623 ◽  
pp. 647-651 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
S. Taniselass ◽  
A.H.M. Shapri ◽  
R. Vairavan

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.


Author(s):  
Pradeep Lall ◽  
Sungmo Jung

Abstract Electronics in automotive underhood environments may be subjected to high temperature in the range of 125–200°C. Transition to electric vehicles has resulted in need for electronics capable of operation under high voltage bias. Automotive electronics has simultaneously transitioned to copper wire-bond from gold wire-bond for first-level interconnections. Copper has a smaller process window and a higher propensity for corrosion in comparison with gold wire bonds. There is scarce information on the reliability of copper wire bonds in presence of high voltage bias under operation at high temperature. In this paper, a multiphysics model for micro galvanic corrosion in the presence of chlorine is introduced. The diffusion cell is used to measure the diffusivity of chlorine in different pH values and different temperatures. Diffusivity measurements are incorporated into the 3D ionic transport model to study the effect of different environmental factors on the transport rate of chlorine. The tafel parameters for copper, aluminum and intermetallics have been extracted through measurements of the polarization curves. The multiple physics of ionic transport in presence of concentration gradient, potential gradient is coupled with the galvanic corrosion.


2019 ◽  
Vol 141 (3) ◽  
Author(s):  
G. Terán ◽  
S. Capula-Colindres ◽  
J. C. Velázquez ◽  
D. Angeles-Herrera ◽  
E. Torres-Santillán

In this study, failure pressure prediction was conducted in a pipeline with localized corrosion in base metal (BM), heat-affected zone (HAZ), and welding bead (WB) by finite element (FE) analysis. In the gas pipeline industry, there are methods (B31G, RESTRENGH, Shell, DNV, PCORR, and Fitnet FFS) and authors' approaches (Choi and Cronin) to determine the failure pressure. However, one disadvantage of these methods is that their equations do not consider damage corrosion at the HAZ or WB. They consider corrosion only in the BM. The corrosion shape is rectangular with a radius at the edges. In this study, the corrosion defect depth (d) was varied. The corrosion defect length (L) and the corrosion defect width (W) were equal. A type of rectangular corrosion defect with a radius at the edges in the longitudinal and circumferential directions was proposed. True stress–strain curves for BM, HAZ, and WB of an API 5 L X52 were introduced in the FE program. The results show that the pressure decreases as d, L, and W increase. This is because the damage corrosion is more severe as it grows, which causes the failure pressure to decrease.


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