Tin whisker mitigation study on alloy 42 pure tin plating

2006 ◽  
Author(s):  
Anocha Sriyarunya ◽  
Jiraporn Tondtan
Keyword(s):  
Tin Whisker ◽  
Tin Plating ◽  
Tin Whisker Mitigation

scholarly journals An investigation of tin whisker growth over a 32-year period

Circuit World ◽  
2016 ◽  
Vol 42 (4) ◽  
pp. 183-196 ◽  
Author(s):  
Mark Andrew Ashworth ◽  
Barrie Dunn
Keyword(s):  
Cross Sections ◽  
Whisker Growth ◽  
Tin Whisker ◽  
Content Type ◽  
Intermetallic Formation ◽  
Time Period ◽  
Whisker Length ◽  
Electron Microscopy Analysis ◽  
Long Time ◽  
Tin Plating

Purpose This paper aims to present the results of a 32-year-old laboratory study of whisker growth from tin electrodeposits that was originally undertaken to gain an increased understanding of the phenomenon of tin whisker growth. Design/methodology/approach Whisker growth was evaluated using electroplated C-rings (both stressed and un-stressed) that were stored throughout in a desiccator at room temperature. Analysis has recently been undertaken to evaluate whisker growth and intermetallic growth after 32 years of storage. Scanning electron microscopy analysis has been performed to investigate whisker length and, using polished cross-sections, the morphology, thickness and type of intermetallic formation. Findings Normal tin-plated deposits on brass and steel with a copper barrier layer nucleated whiskers within five months, and in each case, these grew to lengths between 1 and 4.5 mm. For normal tin electroplated onto brass, a one- or two-month nucleation period was needed before whiskers developed. They reached a maximum length of about 1.5 mm after six months, and little or no further growth occurred during the subsequent 32 years. Very few whiskers grew on the tin-plated steel samples and no intermetallic formation was observed. None of the fused tin plating samples nucleated whiskers during the 32-year period. Practical implications Knowledge about vintage whiskers is important to take steps to increase the resiliency of space missions. Similarly, such knowledge is important to engineers engaged in products reaching their nominal end-of-life, but where, for reasons of economy, these products cannot be replaced. Originality/value This study represents a unique insight into whisker growth and intermetallic formation over an extremely long time period.

scholarly journals The Effects of Humidity on Tin Whisker Growth by Immersion Tin Plating and Tin Solder Dipping Surface Finishes

2015 ◽  
Vol 2 ◽  
pp. 275-279 ◽  
Author(s):  
Hooi Peng Lim ◽  
Ali Ourdjini ◽  
Tuty Asma Abu Bakar ◽  
Tuquabo Tesfamichael
Keyword(s):  
Whisker Growth ◽  
Tin Whisker ◽  
Surface Finishes ◽  
Tin Plating ◽  
Immersion Tin

Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings

2019 ◽  
Vol 166 ◽  
pp. 219-229 ◽  
Author(s):  
Fei Dong ◽  
Stephan J. Meschter ◽  
Shinji Nozaki ◽  
Takeshi Ohshima ◽  
Takahiro Makino ◽  
...  
Keyword(s):  
Tin Whisker ◽  
Coating Adhesion ◽  
Conformal Coatings ◽  
Tin Whisker Mitigation

Tin Whisker mitigation methodologies

2017 ◽  
Vol 95 (4) ◽  
pp. 180-182 ◽  
Author(s):  
Pete Starkey
Keyword(s):  
Tin Whisker ◽  
Tin Whisker Mitigation

scholarly journals Platelet Composite Coatings for Tin Whisker Mitigation

2015 ◽  
Vol 44 (11) ◽  
pp. 4424-4433 ◽  
Author(s):  
Lauren E. S. Rohwer ◽  
James E. Martin
Keyword(s):  
Composite Coatings ◽  
Tin Whisker ◽  
Tin Whisker Mitigation

Solder Fatigue Impacts of Conformal Coating for Tin Whisker Mitigation on Chip-Scale Thin Small Outline Packages

2009 ◽  
Author(s):  
Karl J. L. Geisler
Keyword(s):  
Fatigue Life ◽  
Temperature Cycling ◽  
Tin Whisker ◽  
Conformal Coating ◽  
Failure Data ◽  
Distribution Shape ◽  
Solder Fatigue ◽  
On Chip ◽  
Tin Whisker Mitigation ◽  
The Impact

This study explores the impact of polyurethane conformal coating on the solder fatigue life of 0.5 mm pitch, thin small outline package (TSOP) components. Test samples were subjected to temperature cycling from −40°C to + 100°C. Uncoated samples were tested in addition to sets with 10, 13, and 20 μm thick coatings. Solder joint failure data fit to 3-parameter Weibull distributions demonstrate characteristic fatigue life reductions of 30% with increasing coating thickness but relatively subtle changes to the failure distribution shape.

Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation

2014 ◽  
Vol 561 ◽  
pp. 93-97 ◽  
Author(s):  
Wahyu Diyatmika ◽  
J.P. Chu ◽  
Y.W. Yen ◽  
W.Z. Chang ◽  
C.H. Hsueh
Keyword(s):  
Thin Film ◽  
Metallic Glass ◽  
Room Temperature ◽  
Tin Whisker ◽  
Tin Whisker Mitigation
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