Application of finite element analysis on flip chip ball grid array package with 65nm Cu/low-κ device

2006 ◽  
Author(s):  
A. Yeo ◽  
Tan Ai Min ◽  
C. Lee
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Element Analysis ◽  
Ball Grid Array Package

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

2013 ◽  
Vol 30 (1) ◽  
pp. 14-18 ◽  
Author(s):  
Yap Boon Kar ◽  
Noor Azrina Talik ◽  
Zaliman Sauli ◽  
Jean Siow Fei ◽  
Vithyacharan Retnasamy
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Ball ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Element Analysis

Optimizing System-on-Film (SOF) Design Using Finite Element Analysis

2011 ◽  
Author(s):  
Vikram Venkatadri ◽  
Mark Downey ◽  
Xiaojie Xue ◽  
Dipak Sengupta ◽  
Daryl Santos ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Flexible Substrate ◽  
High Density ◽  
Design Solution ◽  
Design Parameters ◽  
Optimized Design ◽  
Element Analysis ◽  
Bonding Parameters

System-On-Film (SOF) module is a complex integration of a fine pitch high density die and surface mounted discrete devices on a polyimide (PI) film laminate. The die is connected to the film using a thermo-compression flip-chip bonding (TCB) process which is capable of providing a very high density interconnect at less than 50um pitch. Several design and bonding parameters have to be controlled in order to achieve a reliable bond between the Au bumps on the die and the Sn plated Cu traces on the PI film. In the current work, the TCB process is studied using Finite Element Analysis (FEA) to optimize the design parameters and assure proper process margins. The resultant forces acting on the bump-to-trace interfaces are quantified across the different potential geometrical combinations. Baseline simulations showed higher stresses on specific bump locations and stress gradients acting on the bumps along the different sides of the die. These observations were correlated to both the failures and near failures on the actual test vehicles. Further simulations were then utilized to optimize and navigate design tradeoffs at both the die and flexible substrate design levels for a more robust design solution. Construction analysis performed on parts built using optimized design parameters showed significant improvements and correlated well with the simulation results.

Finite element analysis for microwave cure of underfill in flip chip packaging

2004 ◽  
Vol 462-463 ◽  
pp. 436-445 ◽  
Author(s):  
Lie Liu ◽  
Sung Yi ◽  
Lin Seng Ong ◽  
Kerm Sin Chian
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Flip Chip ◽  
Element Analysis ◽  
Flip Chip Packaging
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