Experimental and finite element analysis of cavity down BGA package solder joint reliability

2002 ◽  
Author(s):  
Leilei Zhang ◽  
Soon-Shin Chee ◽  
A. Maheshwari ◽  
A. Funcell
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Joint ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Bga Package

Reliability Analysis of WLCSP Using Tie-Release Crack Prediction Finite Element Technique

2005 ◽  
Author(s):  
Chang-Chun Lee ◽  
Kuo-Ning Chiang
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Solder Joints ◽  
Wafer Level ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Prediction Technique ◽  
Packaging Structure

For the purpose of enhancing the solder joint reliability of a wafer level chip scaling package (WLCSP), the WLCSP adopted the familiar design structure where both the stress compliant layer with low elastic modulus and the dummy solder joints are considered as structural supports. However, the predicted fatigue life of the solder joints at the internal part of the packaging structure using the conventional procedures of finite element simulation are higher than under actual conditions as a result of the perfect bonding assumption in the modeling. In this research, in order to improve the thermo-mechanical reliability of the solder joints, a node tie-release crack prediction technique, based on non-linear finite element analysis (FEA), is developed and compared with the estimation of the solder joint reliability using conventional methodology. The predicted results of reliability, using the novel prediction technique, show a lower fatigue life of the solder joint than that when using conventional one when the fracture regions in the dummy solder joints are simulated under quasi-steady state. At the same time, the result of the thermal cycling test also shows good agreement with the simulated result when using the proposed node tie-release crack prediction analysis.

Finite-element analysis of solder joint strength in laser diode packaging

2000 ◽  
Author(s):  
Chi-Hsiung Chang ◽  
Maw-Tyan Sheen ◽  
Jao-Hwa Kuang ◽  
Chi-Chen Chen ◽  
Gol-Lin Wang ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Joint ◽  
Laser Diode ◽  
Joint Strength ◽  
Element Analysis

scholarly journals Improving the Solder Joint Reliability of a Power Leadframe Package Using Thermomechanical Simulation

2019 ◽  
pp. 1-6
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Mold Material ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Thermomechanical Simulation ◽  
Board Level

Leadframe-based packages are commonly used for semiconductor power devices. With these packages, heat dissipation is much better compared with laminate substrated-based packages. However, the solder joint reliability requirement under thermal cycling condition is also higher and this is what makes the development of a power package challenging. One of the usual requirements from customers is that there should be no solder joint failure up to 2,000 thermal cycles. This paper presents the thermomechanical simulation of a power leadframe package that was conducted to improve its solder joint reliability. Board level solder joint cycle life was predicted using finite element analysis and the result was validated with actual solder life result from board level reliability evaluation. Since available solder prediction equation was for the characteristic life (63.2% accumulative failure), using the normalized characteristic life was implemented for predicting the number of cycles to first failure of the solder joint connection and the approach showed good agreement with the actual result. Results also indicated that the choice of epoxy mold material and the type of PCB (printed circuit board) have a significant contribution to the solder joint reliability performance.

scholarly journals Study on the Impact of Lead Sidewall Solder Coverage and Corner Lead Size on Joint Reliability

2021 ◽  
pp. 62-69
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Integrated Circuit ◽  
High Speed ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Solder Fatigue ◽  
The Impact

Solder joint reliability is very important to ensure that an integrated circuit (IC) semiconductor package is functional within its intended life span as the solder joint establishes electrical connection between the IC and the printed circuit board (PCB). Solder fatigue failure or crack under thermal cycling is one of the common problems with board-mounted packages. There are several factors or package characteristics that have impact on solder fatigue life like package size and material properties of the package components. This paper presents a thermo-mechanical modeling of a leadframe-based semiconductor package to study the impact of lead sidewall solder coverage and corner lead size on the solder joint reliability. Finite element analysis (FEA) technique was used to calculate the solder life considering 50% and 100% package lead sidewall solder coverage as well as smaller and larger critical corner leads of the package. The results of the analysis showed that higher lead sidewall solder coverage and larger lead could significantly increase solder life. Therefore, ensuring lead sidewall solder wettability to have higher solder coverage is beneficial. The study also reveals that packages with side wettable flanks are not only enabling high speed automated optical inspection required for the automotive industry, but they are also providing improved solder joint reliability.

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