Air entrapment in sheet molding compounds (SMC)

1986 ◽  
Vol 7 (6) ◽  
pp. 431-434 ◽  
Author(s):  
Dag Slotfeldt-Ellingsen ◽  
Elisabeth Magnus ◽  
Eric Ekern ◽  
Egil Holtmon ◽  
Lars Corneliussen
Keyword(s):  
Air Entrapment ◽  
Molding Compounds

Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds

2019 ◽  
Vol 99 ◽  
pp. 161-167 ◽  
Author(s):  
Shih-Chieh Chao ◽  
Wei-Chen Huang ◽  
Jen-Hsiang Liu ◽  
Jenn-Ming Song ◽  
Po-Yen Shen ◽  
...  
Keyword(s):  
Lead Frame ◽  
Molding Compounds ◽  
Oxidation Characteristics ◽  
Commercial Copper

SSM Provides Important Advantages; So, why has SSM Failed to Achieve Greater Market Share?

2014 ◽  
Vol 217-218 ◽  
pp. 481-486 ◽  
Author(s):  
John L. Jorstad
Keyword(s):  
Turbulent Flow ◽  
Heat Treating ◽  
Solid Metal ◽  
Light Metals ◽  
Solidification Shrinkage ◽  
Air Entrapment ◽  
Thin Sections ◽  
Metal Processing ◽  
Semi Solid ◽  
Minimum Heat

Semi solid metal processing has numerous technical and economic advantages, such as viscous, non-turbulent flow (thus no air entrapment during casting), ability to fill ultra-thin sections (thus reduced part weight), little solidification shrinkage in the die (thus little or no porosity), minimum heat imparted to tooling (thus long tool life) and good response to T-5 aging (thus reduced heat treating costs). Still, SSM has never achieved a prominent position in the field of light metals casting Why? Perhaps the reason was largely the down economy of recent years and SSM will yet emerge with the prominence once expected of it.

Adhesion Strengths of Epoxy Molding Compounds to Gold-plated Copper Leadframes

2000 ◽  
Vol 73 (1) ◽  
pp. 1-17 ◽  
Author(s):  
Sung Yl ◽  
Jang-Kyo Kim ◽  
Chee Yoon Yue ◽  
Jang-Hsing Hsieh
Keyword(s):  
Molding Compounds

scholarly journals Volumetrical Characterization of Sheet Molding Compounds

Materials ◽  
2010 ◽  
Vol 3 (12) ◽  
pp. 5083-5096 ◽  
Author(s):  
Alfredo Calvimontes ◽  
Karina Grundke ◽  
Anett Müller
Keyword(s):  
Molding Compounds

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

2012 ◽  
Vol 52 (11) ◽  
pp. 2677-2684 ◽  
Author(s):  
Andrej Ivankovic ◽  
Kris Vanstreels ◽  
Daniel Vanderstraeten ◽  
Guy Brizar ◽  
Renaud Gillon ◽  
...  
Keyword(s):  
Elastic Modulus ◽  
Experimental Methods ◽  
Molding Compounds ◽  
Ic Packaging

Alternative procedures for the recycling of sheet molding compounds

1993 ◽  
Vol 12 (1) ◽  
pp. 35-45 ◽  
Author(s):  
S. H. Patel ◽  
K. E. Gonsalves ◽  
S. S. Stivala ◽  
L. Reich ◽  
D. H. Trivedi
Keyword(s):  
Molding Compounds ◽  
Alternative Procedures
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