Thin film failure using an interface delamination law

Superlayer Test for Interfacial Fracture Toughness Measurements

Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology ◽

10.1115/imece2004-61839 ◽

2004 ◽

Author(s):

Jiantao Zheng ◽

Suresh K. Sitaraman

Keyword(s):

Thin Film ◽

Fracture Toughness ◽

Interfacial Fracture ◽

Critical Energy ◽

Interfacial Fracture Toughness ◽

Mode Mixity ◽

Critical Energy Release Rate ◽

Component Reliability ◽

Interfacial Delamination ◽

Interface Delamination

Knowledge of the mode-mixity (?) dependent interfacial fracture toughness (Γ) is needed to predict the interface delamination and the component reliability of thin-film structures. Mode-mixity, ?, is a measure of the relative shearing to tensile opening of the interface crack near the tip. Typically, Γ increases as ? increases, such that the delamination is less likely when the loading on the interface is shear-dominated. The measurement of mode-mixity dependent Γ has been a challenge for thin film interfaces. The single-strip superlayer test, developed by the authors, eliminates the shortcomings of current testing methods. This test employs a stress-engineered superlayer to drive the interfacial delamination between the thin-film and the substrate. An innovative aspect of the proposed test is to introduce a release layer of varying width between the interested interfaces to control the amount of energy available for delamination propagation. By designing a decreasing area of the release layer, it is possible to arrest the interfacial delamination at a given location, and the interfacial fracture toughness or critical energy release rate can be found at the location where the delamination ceases to propagate. Design, preparation, and execution of the test are presented. Results are shown for Ti/Si interfaces of different mode mixities.

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Finite element analysis of interface delamination and buckling in thin film systems by wedge indentation

Engineering Fracture Mechanics ◽

10.1016/j.engfracmech.2006.12.025 ◽

2007 ◽

Vol 74 (7) ◽

pp. 1118-1125 ◽

Cited By ~ 10

Author(s):

P. Liu ◽

Y.W. Zhang ◽

K.Y. Zeng ◽

C. Lu ◽

K.Y. Lam

Keyword(s):

Thin Film ◽

Finite Element Analysis ◽

Finite Element ◽

Element Analysis ◽

Interface Delamination ◽

Wedge Indentation

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Effects of sliding on interface delamination during thin film buckling

Scripta Materialia ◽

10.1016/j.scriptamat.2012.04.004 ◽

2012 ◽

Vol 67 (2) ◽

pp. 157-160 ◽

Cited By ~ 12

Author(s):

Antoine Ruffini ◽

Julien Durinck ◽

Jérôme Colin ◽

Christophe Coupeau ◽

Jean Grilhé

Keyword(s):

Thin Film ◽

Interface Delamination

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Failure criteria in thin film lubrication: Investigation of the different stages of film failure

Wear ◽

10.1016/0043-1648(76)90139-3 ◽

1976 ◽

Vol 36 (1) ◽

pp. 13-17 ◽

Cited By ~ 24

Author(s):

H. Czichos

Keyword(s):

Thin Film ◽

Failure Criteria ◽

Thin Film Lubrication ◽

Film Lubrication ◽

Film Failure

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The Effects of Environment and Fatigue on the Adhesion and Subcritical Debonding of Dielectric Polymers

MRS Proceedings ◽

10.1557/proc-565-123 ◽

1999 ◽

Vol 565 ◽

Cited By ~ 2

Author(s):

J. M. Snodgrass ◽

D. Pantelidis ◽

J. C. Bravman ◽

R. H. Dauskardt

Keyword(s):

Thin Film ◽

Cyclic Loading ◽

Silicon Dioxide ◽

Double Cantilever Beam ◽

Time Dependent ◽

Interface Fracture ◽

Layered Systems ◽

Beam Geometry ◽

Interface Delamination ◽

Microelectronic Processing

AbstractThe adhesion of thin film polymers will be critical in the integration of low-κ materials into microelectronic processing. This study describes the adhesion of two promising low-κ polymers (polyimide and benzocyclobutene) to a silicon dioxide surface. Critical adhesion values were measured using interface fracture mechanics samples in a double cantilever beam geometry. The effect of subcritical (time-dependent) delamination was also evaluated for these systems. Subcritical debonding data are important in understanding the effect of environment and temperature on interface reliability. To that end, experiments were conducted over a range of humidities to elucidate the effect of moisture on interface delamination. The important effect of the acceleration of debond growth rates due to cyclic loading is also described. In addition, XPS studies are presented to characterize the debond path in these layered systems.

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