High performance flexible electronics for biomedical devices

2014 ◽  
Author(s):  
Giovanni A. Salvatore ◽  
Niko Munzenrieder ◽  
Christoph Zysset ◽  
Thomas Kinkeldei ◽  
Luisa Petti ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Biomedical Devices

Double-network hydrogel with adjustable surface morphology and multifunctional integration for flexible strain sensors

Soft Matter ◽  
2021 ◽  
Author(s):  
Yang Yu ◽  
Fengjin Xie ◽  
Xinpei Gao ◽  
Liqiang Zheng
Keyword(s):  
Surface Morphology ◽  
Flexible Electronics ◽  
High Performance ◽  
Strain Sensors ◽  
Next Generation ◽  
Double Network ◽  
Conductive Hydrogels

The next generation of high-performance flexible electronics has put forward new demands to the development of ionic conductive hydrogels. In recent years, many efforts have been made toward developing double-network...

Stretchable Systems

2021 ◽  
Author(s):  
Yogeenth Kumaresan ◽  
Nivasan Yogeswaran ◽  
Luigi G. Occhipinti ◽  
Ravinder Dahiya
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Electrical Response ◽  
Inorganic Compounds ◽  
Stretchable Electronics ◽  
Material Research ◽  
Active Materials ◽  
Challenges And Opportunities ◽  
Integration Techniques ◽  
Strain Invariant

Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.

Fused filament printing of specialized biomedical devices: a state-of-the art review of technological feasibilities with PEEK

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Erfan Rezvani Ghomi ◽  
Saeideh Kholghi Eshkalak ◽  
Sunpreet Singh ◽  
Amutha Chinnappan ◽  
Seeram Ramakrishna ◽  
...  
Keyword(s):  
High Performance ◽  
State Of The Art ◽  
Three Dimensional ◽  
Patient Specific ◽  
Biomedical Devices ◽  
Fused Filament Fabrication ◽  
Content Type ◽  
Patient Specific Implants ◽  
Complex Design ◽  
Wide Range

Purpose The potential implications of the three-dimensional printing (3DP) technology are growing enormously in the various health-care sectors, including surgical planning, manufacturing of patient-specific implants and developing anatomical models. Although a wide range of thermoplastic polymers are available as 3DP feedstock, yet obtaining biocompatible and structurally integrated biomedical devices is still challenging owing to various technical issues. Design/methodology/approach Polyether ether ketone (PEEK) is an organic and biocompatible compound material that is recently being used to fabricate complex design geometries and patient-specific implants through 3DP. However, the thermal and rheological features of PEEK make it difficult to process through the 3DP technologies, for instance, fused filament fabrication. The present review paper presents a state-of-the-art literature review of the 3DP of PEEK for potential biomedical applications. In particular, a special emphasis has been given on the existing technical hurdles and possible technological and processing solutions for improving the printability of PEEK. Findings The reviewed literature highlighted that there exist numerous scientific and technical means which can be adopted for improving the quality features of the 3D-printed PEEK-based biomedical structures. The discussed technological innovations will help the 3DP system to enhance the layer adhesion strength, structural stability, as well as enable the printing of high-performance thermoplastics. Originality/value The content of the present manuscript will motivate young scholars and senior scientists to work in exploring high-performance thermoplastics for 3DP applications.

All-Printed Carbon Nanotube finFETs on Plastic Substrates for High-Performance Flexible Electronics

2011 ◽  
Vol 24 (3) ◽  
pp. 358-361 ◽  
Author(s):  
Jingsheng Shi ◽  
Chun Xian Guo ◽  
Mary B. Chan-Park ◽  
Chang Ming Li
Keyword(s):  
Carbon Nanotube ◽  
Flexible Electronics ◽  
High Performance ◽  
Plastic Substrates

Fe-42%Ni austenitic alloy as a novel substrate for flexible electronics

2011 ◽  
Vol 1285 ◽  
Author(s):  
Xiaoxiao Ma ◽  
Shahrukh A. Khan ◽  
Nackbong Choi ◽  
Miltiadis Hatalis ◽  
Mark Robinson
Keyword(s):  
Flexible Electronics ◽  
Field Effect ◽  
High Performance ◽  
Flexible Substrate ◽  
Good Choice ◽  
Annealing Process ◽  
Field Effect Mobility ◽  
Current Ratio ◽  
Bottom Gate ◽  
Igzo Tft

ABSTRACTWe report Fe-42%Ni as a novel high-performance substrate for a-IGZO TFT fabrication after evaluating 8 different metals for chemical compatibility, mechanical flexing and dimensional stability. Excellent flexibility and rollability indicates that Fe-42%Ni would be a good choice as flexible substrate for R2R process. Pre-annealing process for stabilizing the substrate is studied and applied to the Fe-42%Ni foil before TFT fabrication. Staggered bottom gate a-IGZO TFTs which were fabricated on this substrate have field effect mobility of 12 cm2/V.s, threshold voltage of 2V, sub-threshold swing of 0.6V/decade and on/off current ratio exceeding 107.

scholarly journals Copercolating Networks: An Approach for Realizing High-Performance Transparent Conductors using Multicomponent Nanostructured Networks

Nanophotonics ◽  
2016 ◽  
Vol 5 (1) ◽  
pp. 180-195 ◽  
Author(s):  
Suprem R. Das ◽  
Sajia Sadeque ◽  
Changwook Jeong ◽  
Ruiyi Chen ◽  
Muhammad A. Alam ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
Indium Tin Oxide ◽  
High Performance ◽  
Silver Nanowires ◽  
Optical Transmittance ◽  
Single Component ◽  
Transparent Conductors ◽  
Hybrid Networks ◽  
Gold Nanowires ◽  
Metallic Nanowire Networks

Abstract Although transparent conductive oxides such as indium tin oxide (ITO) are widely employed as transparent conducting electrodes (TCEs) for applications such as touch screens and displays, new nanostructured TCEs are of interest for future applications, including emerging transparent and flexible electronics. A number of twodimensional networks of nanostructured elements have been reported, including metallic nanowire networks consisting of silver nanowires, metallic carbon nanotubes (m-CNTs), copper nanowires or gold nanowires, and metallic mesh structures. In these single-component systems, it has generally been difficult to achieve sheet resistances that are comparable to ITO at a given broadband optical transparency. A relatively new third category of TCEs consisting of networks of 1D-1D and 1D-2D nanocomposites (such as silver nanowires and CNTs, silver nanowires and polycrystalline graphene, silver nanowires and reduced graphene oxide) have demonstrated TCE performance comparable to, or better than, ITO. In such hybrid networks, copercolation between the two components can lead to relatively low sheet resistances at nanowire densities corresponding to high optical transmittance. This review provides an overview of reported hybrid networks, including a comparison of the performance regimes achievable with those of ITO and single-component nanostructured networks. The performance is compared to that expected from bulk thin films and analyzed in terms of the copercolation model. In addition, performance characteristics relevant for flexible and transparent applications are discussed. The new TCEs are promising, but significant work must be done to ensure earth abundance, stability, and reliability so that they can eventually replace traditional ITO-based transparent conductors.

scholarly journals Sequential Oxidation Strategy for the Fabrication of Liquid Metal Electrothermal Thin Film with Desired Printing and Functional Property

Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1539
Author(s):  
Jun-Heng Fu ◽  
Xu-Dong Zhang ◽  
Peng Qin ◽  
Jing Liu
Keyword(s):  
Thin Film ◽  
Liquid Metal ◽  
Composite Film ◽  
Flexible Electronics ◽  
High Performance ◽  
Polyimide Film ◽  
Great Promise ◽  
Metal Composite ◽  
Resistive Layer ◽  
Film Substrate

Room temperature liquid metal (LM) showcases a great promise in the fields of flexible functional thin film due to its favorable characteristics of flexibility, inherent conductivity, and printability. Current fabrication strategies of liquid metal film are substrate structure specific and sustain from unanticipated smearing effects. Herein, this paper reported a facile fabrication of liquid metal composite film via sequentially regulating oxidation to change the adhesion characteristics, targeting the ability of electrical connection and electrothermal conversion. The composite film was then made of the electrically resistive layer (oxidizing liquid metal) and the insulating Polyimide film (PI film) substrate, which has the advantages of electrical insulation and ultra-wide temperature working range, and its thickness is only 50 μm. The electrical resistance of composite film can maintain constant for 6 h and could work normally. Additionally, the heating film exhibited excellent thermal switching characteristics that can reach temperature equilibrium within 100 s, and recovery to ambient temperature within 50 s. The maximum working temperature of the as-prepared film is 115 °C, which is consistent with the result of the theoretical calculation, demonstrating a good electrothermal conversion capability. Finally, the heating application under extreme low temperature (−196 °C) was achieved. This conceptual study showed the promising value of the prototype strategy to the specific application areas such as the field of smart homes, flexible electronics, wearable thermal management, and high-performance heating systems.

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