Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free Solder Joints in Different Corrosive Environmental Conditions

2006 ◽  
Author(s):  
C. Andersson ◽  
J. Liu
Keyword(s):  
Environmental Conditions ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Free Solder

Low-cycle fatigue behavior and mechanisms of a lead-free solder 96.5Sn/3.5Ag

2002 ◽  
Vol 31 (2) ◽  
pp. 142-151 ◽  
Author(s):  
Chaosuan Kanchanomai ◽  
Yukio Miyashita ◽  
Yoshiharu Mutoh
Keyword(s):  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Free Solder

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

2015 ◽  
Author(s):  
Takashi Kawakami ◽  
Takahiro Kinoshita ◽  
Hirokazu Oriyama
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Lead Free ◽  
Design Rule ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Stress Strain ◽  
Test Pieces ◽  
Free Solder

Solder joints are sometimes opened under thermal cyclic loads as low cycle fatigue phenomena. The fatigue crack is usually initiated around the edge of the interface where stress and strain very severely concentrate, having stress strain singularity. In this study, Sn-3.0Ag-0.5Cu test pieces with V shape notch were supplied to low cycle fatigue tests at 100°C. And inelastic stress strain simulations, which were based on time-dependent non-unified material model, were carried out under several cyclic load levels to obtain strain distributions around the bottom of the V notch. By results of fatigue test and inelastic simulation, the depth from the bottom of the V notch, where the strain range agrees with the prediction of the fatigue life based on smooth test pieces on Coffin-Manson rule, was investigated as the mechanical design rule for lead free solder joints.

Low Cycle Fatigue Behavior and Surface Feature by Image Processing of Sn-0.7Cu Lead-Free Solder

2006 ◽  
Vol 306-308 ◽  
pp. 115-120 ◽  
Author(s):  
Takehiko Takahashi ◽  
Susumu Hioki ◽  
Ikuo Shohji ◽  
Osamu Kamiya
Keyword(s):  
Fatigue Life ◽  
Fatigue Test ◽  
Surface Deformation ◽  
Low Cycle Fatigue ◽  
Fatigue Behavior ◽  
Surface Feature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cycle Fatigue ◽  
Free Solder

The low-cycle fatigue behavior on Sn-0.7Cu lead-free solder as-cast and Sn-Pb eutectic solder as-cast were investigated at a strain rate 0.1%/s under various temperatures of 25, 80 and 120oC. In addition, the relationships between the surface feature in the low-cycle fatigue test and low-cycle fatigue life of those solders at 25oC were investigated by image processing. The low-cycle fatigue life of Sn-0.7Cu decreased when the temperature increased. And the fatigue life of Sn-0.7Cu was better than that of the Sn-Pb eutectic solder at the temperatures of 25 and 80oC. The low-cycle fatigue behavior on the solders investigated followed Coffin-Manson equation. The fatigue ductility coefficient of Sn-0.7Cu was found to be affected by the temperature. The surface deformation as fine meshes in the low-cycle fatigue test of Sn-0.7Cu did not appear until 10% of the fatigue life. Although it was over 10% of the fatigue life, the surface deformation that was caused by micro cracks and coalesces occurred with the increasing number of cycles. The relationships between the surface feature in the low-cycle fatigue test and the low-cycle fatigue life on Sn-0.7Cu and Sn-37Pb solders were discussed.

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