Development of forming and product properties of copper wire in a linear coil winding process

2017 ◽  
Author(s):  
Anna Komodromos ◽  
Christian Lobbe ◽  
A. Erman Tekkaya
Keyword(s):  
Copper Wire ◽  
Coil Winding

scholarly journals Modelling Interdependencies in an Electrical Motor Manufacturing Process Involving Deformable Material

2021 ◽  
Author(s):  
Izhar Oswaldo Escudero-Ornelas ◽  
Divya Tiwari ◽  
Michael Farnsworth ◽  
Ashutosh Tiwari
Keyword(s):  
Manufacturing Process ◽  
Copper Wire ◽  
Discrete Event ◽  
Electrical Machines ◽  
Electrical Machine ◽  
Efficient Production ◽  
Computational Framework ◽  
Event Simulation ◽  
Deformable Material ◽  
Coil Winding

Electrical machines have recently received a lot of attention due to a variety of applications in several industries. Although advances in digital technologies have enabled more efficient production of electrical machines, faults are still identified at the end of the line tests. In order to avoid accumulation of defects during the production chain, it is desirable to identify faults early in the process. This can be achieved by identifying how critical process parameters and the interdependencies between them influence the occurrence of faults. This poses a challenge in electrical machine manufacturing because of the complexity involved in various manufacturing steps involving deformable material, an example is coil winding. This paper proposes a computational framework to model interdependencies in a complex electrical machine manufacturing process involving deformable material. A Discrete Event Simulation model representing the coil winding process demonstrated that input parameters such as wire tension and winding speed influence physical and electrical properties of the coil (enamelled copper wire) leading to generation of defects in the final product.

Scanning and Transmission Electron Microscopy of Endomentrium in Women Wearing TCu-380-A IUD 's

1977 ◽  
Vol 35 ◽  
pp. 666-667
Author(s):  
A. Gonzalez Angulo ◽  
R. Berlioz ◽  
R. Aznar
Keyword(s):  
Copper Wire ◽  
Uterine Cavity ◽  
Morphological Evidence ◽  
Secretory Phase ◽  
Ultrastructural Studies ◽  
Proliferative Phase ◽  
Contraceptive Devices ◽  
Transmission Electron ◽  
Intrauterine Contraceptive ◽  
Myelin Figure

Recent ultrastructural studies on endometrial tissues from women wearing copper, wire intrauterine devices have disclosed morphological evidence of impaired glycogen degradation and secretion resulting in interference with the viability of blastocysts. Reduced microapocrine secretion observed with the scanning electron microscope supports this (1). In addition, organelle modifications have been observed in the epithelial cells of these women. The changes are seen in biopsies taken in the proliferative phase of the cycle and consist of mitochondrial vacuolation and myelin figure formation. These modifications disappear in the secretory phase and therefore have been regarded as reversible (2).The aim of the present studies was to investigate surface epithelial changes as well as organelle modifications in relation to the site of contact with an IUD that releases greater amounts of copper. Endometrial tissue was obtained from the uterine cavity of four young women wearing TCu-380-A intrauterine contraceptive devices for 4-6 weeks.

Reduction of AC Copper Loss in Rectangular Copper Wire using Magnetic Path Control Technology

2020 ◽  
Vol 140 (7) ◽  
pp. 364-371
Author(s):  
Kenta Torishima ◽  
Kazuhiro Shimura ◽  
Mitsuhide Sato ◽  
Tsutomu Mizuno
Keyword(s):  
Copper Wire ◽  
Control Technology ◽  
Copper Loss ◽  
Path Control

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

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