Varnish bonded glass covered copper conductors. Round copper wire

1953 ◽  
Keyword(s):  
Copper Wire

Scanning and Transmission Electron Microscopy of Endomentrium in Women Wearing TCu-380-A IUD 's

1977 ◽  
Vol 35 ◽  
pp. 666-667
Author(s):  
A. Gonzalez Angulo ◽  
R. Berlioz ◽  
R. Aznar
Keyword(s):  
Copper Wire ◽  
Uterine Cavity ◽  
Morphological Evidence ◽  
Secretory Phase ◽  
Ultrastructural Studies ◽  
Proliferative Phase ◽  
Contraceptive Devices ◽  
Transmission Electron ◽  
Intrauterine Contraceptive ◽  
Myelin Figure

Recent ultrastructural studies on endometrial tissues from women wearing copper, wire intrauterine devices have disclosed morphological evidence of impaired glycogen degradation and secretion resulting in interference with the viability of blastocysts. Reduced microapocrine secretion observed with the scanning electron microscope supports this (1). In addition, organelle modifications have been observed in the epithelial cells of these women. The changes are seen in biopsies taken in the proliferative phase of the cycle and consist of mitochondrial vacuolation and myelin figure formation. These modifications disappear in the secretory phase and therefore have been regarded as reversible (2).The aim of the present studies was to investigate surface epithelial changes as well as organelle modifications in relation to the site of contact with an IUD that releases greater amounts of copper. Endometrial tissue was obtained from the uterine cavity of four young women wearing TCu-380-A intrauterine contraceptive devices for 4-6 weeks.

Reduction of AC Copper Loss in Rectangular Copper Wire using Magnetic Path Control Technology

2020 ◽  
Vol 140 (7) ◽  
pp. 364-371
Author(s):  
Kenta Torishima ◽  
Kazuhiro Shimura ◽  
Mitsuhide Sato ◽  
Tsutomu Mizuno
Keyword(s):  
Copper Wire ◽  
Control Technology ◽  
Copper Loss ◽  
Path Control

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

scholarly journals Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

2021 ◽  
Vol 2 (1) ◽  
Author(s):  
Qingzhong Mao ◽  
Yusheng Zhang ◽  
Yazhou Guo ◽  
Yonghao Zhao
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Electrical Conductivity ◽  
Yield Strength ◽  
High Speed ◽  
Copper Wire ◽  
Rapid Development ◽  
Dislocation Slip ◽  
Ultrafine Grains ◽  
The Wire

AbstractThe rapid development of high-speed rail requires copper contact wire that simultaneously possesses excellent electrical conductivity, thermal stability and mechanical properties. Unfortunately, these are generally mutually exclusive properties. Here, we demonstrate directional optimization of microstructure and overcome the strength-conductivity tradeoff in copper wire. We use rotary swaging to prepare copper wire with a fiber texture and long ultrafine grains aligned along the wire axis. The wire exhibits a high electrical conductivity of 97% of the international annealed copper standard (IACS), a yield strength of over 450 MPa, high impact and wear resistances, and thermal stability of up to 573 K for 1 h. Subsequent annealing enhances the conductivity to 103 % of IACS while maintaining a yield strength above 380 MPa. The long grains provide a channel for free electrons, while the low-angle grain boundaries between ultrafine grains block dislocation slip and crack propagation, and lower the ability for boundary migration.

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