A Novel Interconnection Technology Using Ultra-Thin Under Barrier Metal for Multiple Chip-on-Chip Stacking Structure
1996 ◽
Vol 54
◽
pp. 944-945
1992 ◽
Vol 139
(1)
◽
pp. 21
2018 ◽
Vol 138
(1)
◽
pp. 41-49
2016 ◽
Vol 136
(6)
◽
pp. 244-249