Sub-Micron RDL Patterning for Advanced Packaging

2019 ◽  
Author(s):  
Ken-Ichiro Mori ◽  
Yoshio Goto ◽  
Yasuo Hasegawa ◽  
Seiya Miura ◽  
Douglas Shelton
Keyword(s):  
Advanced Packaging

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

scholarly journals A Hermetic Advanced Packaging Solution for Optical Devices Using a Glass-Capping Technology on Wafer-Level

2009 ◽  
Vol 1 (1) ◽  
pp. 1527-1530
Author(s):  
S. Maus ◽  
U. Hansen ◽  
J. Leib ◽  
M. Töpper
Keyword(s):  
Optical Devices ◽  
Wafer Level ◽  
Advanced Packaging

PVD systems for advanced packaging applications

2018 ◽  
Author(s):  
Jinguo Zhen ◽  
Kuanmao Wang ◽  
Wei Xia ◽  
Hougong Wang ◽  
Peijun Ding
Keyword(s):  
Advanced Packaging

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

1999 ◽  
Author(s):  
Jianbiao Pan ◽  
Gregory L. Tonkay
Keyword(s):  
Flip Chip ◽  
Deposition Process ◽  
Area Ratio ◽  
Solder Paste ◽  
Stencil Printing ◽  
Printing Process ◽  
Surface Mount ◽  
Fine Pitch ◽  
Main Indicator ◽  
Advanced Packaging

Abstract Stencil printing has been the dominant method of solder deposition in surface mount assembly. With the development of advanced packaging technologies such as ball grid array (BGA) and flip chip on board (FCOB), stencil printing will continue to play an important role. However, the stencil printing process is not completely understood because 52–71 percent of fine and ultra-fine pitch surface mount assembly defects are printing process related (Clouthier, 1999). This paper proposes an analytical model of the solder paste deposition process during stencil printing. The model derives the relationship between the transfer ratio and the area ratio. The area ratio is recommended as a main indicator for determining the maximum stencil thickness. This model explains two experimental phenomena. One is that increasing stencil thickness does not necessarily lead to thicker deposits. The other is that perpendicular apertures print thicker than parallel apertures.

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