2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04

Study and characterizations on the post cure behavior of underfill

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1288015 ◽

2004 ◽

Cited By ~ 2

Author(s):

Zhuqing Zhang ◽

C.P. Wong

Keyword(s):

Cure Behavior

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Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1288016 ◽

2004 ◽

Cited By ~ 1

Author(s):

Woonbae Kim ◽

Qian Wang ◽

Kyudong Jung ◽

Junsik Hwang ◽

Changyoul Moon

Keyword(s):

Rf Mems ◽

Wafer Level ◽

Eutectic Bonding ◽

Wafer Level Packaging

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Packaging of Cu/low-k IC devices: a novel surface passivation and direct fine-pitched gold wirebond ball interconnects analysis

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1287988 ◽

2004 ◽

Author(s):

S. Chungpaiboonpatana ◽

F.G. Shi ◽

G.P. Lip

Keyword(s):

Surface Passivation ◽

Low K

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Influence of materials data on the performance modelling in the design of MEMS packages

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1287989 ◽

2004 ◽

Cited By ~ 6

Author(s):

S. Fischer ◽

J. Wilde ◽

E. Deier ◽

E. Zukowski

Keyword(s):

Performance Modelling

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Novel board material technology for next-generation packaging

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1288021 ◽

2004 ◽

Author(s):

N. Kumbhat ◽

S. Hegde ◽

P. Markondeya Raj ◽

R.V. Pucha ◽

R. Doraiswami ◽

...

Keyword(s):

Next Generation ◽

Material Technology ◽

Board Material

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Formulation of different shapes of nanoparticles and their incorporation into polymers

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1288013 ◽

2004 ◽

Author(s):

S. Pothukuchi ◽

Yi Li ◽

C.P. Wong

Keyword(s):

Different Shapes

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Display driver packaging: ACF reaching the limits?

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1287980 ◽

2004 ◽

Cited By ~ 6

Author(s):

P. Savolainen

Keyword(s):

Display Driver

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Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1287991 ◽

2004 ◽

Author(s):

A.O. Aggarwal ◽

P.M. Raj ◽

I.R. Abothu ◽

D. Ravi ◽

M.D. Sacks ◽

...

Keyword(s):

Thin Film ◽

Material Synthesis ◽

Synthesis Routes

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A new method to measure dielectric constant and dissipation factor of printed circuit board laminate material in function of temperature and frequency

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1288019 ◽

2004 ◽

Cited By ~ 12

Author(s):

J.-M. Heinola ◽

K.-P. Latti ◽

P. Silventoinen ◽

J.-P. Strom ◽

M. Kettunen

Keyword(s):

Dielectric Constant ◽

Printed Circuit Board ◽

Dissipation Factor ◽

New Method ◽

Circuit Board ◽

Laminate Material ◽

Printed Circuit

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High aspect ratio metal-polymer composite structures for nano interconnects

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04 ◽

10.1109/isapm.2004.1288010 ◽

2004 ◽

Cited By ~ 2

Author(s):

A.O. Aggarwal ◽

P.M. Raj ◽

R.R. Tummala

Keyword(s):

Aspect Ratio ◽

Polymer Composite ◽

High Aspect Ratio ◽

Composite Structures ◽

Metal Polymer

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2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Study and characterizations on the post cure behavior of underfill

Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging

Packaging of Cu/low-k IC devices: a novel surface passivation and direct fine-pitched gold wirebond ball interconnects analysis

Influence of materials data on the performance modelling in the design of MEMS packages

Novel board material technology for next-generation packaging

Formulation of different shapes of nanoparticles and their incorporation into polymers

Display driver packaging: ACF reaching the limits?

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

A new method to measure dielectric constant and dissipation factor of printed circuit board laminate material in function of temperature and frequency

High aspect ratio metal-polymer composite structures for nano interconnects

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2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Study and characterizations on the post cure behavior of underfill

Application of Au-Sn eutectic bonding in hermetic RF MEMS wafer level packaging

Packaging of Cu/low-k IC devices: a novel surface passivation and direct fine-pitched gold wirebond ball interconnects analysis

Influence of materials data on the performance modelling in the design of MEMS packages

Novel board material technology for next-generation packaging

Formulation of different shapes of nanoparticles and their incorporation into polymers

Display driver packaging: ACF reaching the limits?

Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects

A new method to measure dielectric constant and dissipation factor of printed circuit board laminate material in function of temperature and frequency

High aspect ratio metal-polymer composite structures for nano interconnects

2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat No 04EX745) ISAPM-04
Latest Publications