Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell Resonators

2018 ◽  
Author(s):  
Zhaoxi Su ◽  
Jintang Shang ◽  
Bin Luo ◽  
Ching-Ping Wong
Keyword(s):  
Fabrication Process ◽  
Wafer Level ◽  
Glass Shell ◽  
Size Uniformity

scholarly journals Hybrid Multisite Silicon Neural Probe with Integrated Flexible Connector for Interchangeable Packaging

Sensors ◽  
2021 ◽  
Vol 21 (8) ◽  
pp. 2605
Author(s):  
Ashley Novais ◽  
Carlos Calaza ◽  
José Fernandes ◽  
Helder Fonseca ◽  
Patricia Monteiro ◽  
...  
Keyword(s):  
Fabrication Process ◽  
High Signal ◽  
Wafer Level ◽  
Neural Probes ◽  
Insertion Force ◽  
Precise Integration ◽  
Flexible Cable ◽  
Flexible Polymer ◽  
Hybrid Silicon

Multisite neural probes are a fundamental tool to study brain function. Hybrid silicon/polymer neural probes combine rigid silicon and flexible polymer parts into one single device and allow, for example, the precise integration of complex probe geometries, such as multishank designs, with flexible biocompatible cabling. Despite these advantages and benefiting from highly reproducible fabrication methods on both silicon and polymer substrates, they have not been widely available. This paper presents the development, fabrication, characterization, and in vivo electrophysiological assessment of a hybrid multisite multishank silicon probe with a monolithically integrated polyimide flexible interconnect cable. The fabrication process was optimized at wafer level, and several neural probes with 64 gold electrode sites equally distributed along 8 shanks with an integrated 8 µm thick highly flexible polyimide interconnect cable were produced. The monolithic integration of the polyimide cable in the same fabrication process removed the necessity of the postfabrication bonding of the cable to the probe. This is the highest electrode site density and thinnest flexible cable ever reported for a hybrid silicon/polymer probe. Additionally, to avoid the time-consuming bonding of the probe to definitive packaging, the flexible cable was designed to terminate in a connector pad that can mate with commercial zero-insertion force (ZIF) connectors for electronics interfacing. This allows great experimental flexibility because interchangeable packaging can be used according to experimental demands. High-density distributed in vivo electrophysiological recordings were obtained from the hybrid neural probes with low intrinsic noise and high signal-to-noise ratio (SNR).

Alternative Compliant Interconnects: Thermo-Mechanical Reliability, Design and Testing

2001 ◽  
Author(s):  
Lunyu Ma ◽  
Qi Zhu ◽  
Suresh Sitaraman
Keyword(s):  
Low Cost ◽  
Fabrication Process ◽  
Design Parameters ◽  
Electronic Packages ◽  
Wafer Level ◽  
Free Standing ◽  
Reliability Design ◽  
Fine Pitch ◽  
Conventional Photolithography ◽  
Design And Testing

Abstract Two types of novel compliant interconnects are being proposed in this paper. The advantages of these two types of compliant interconnects are: accommodation of the mismatch due to different thermal expansions in electronic packages, integration with wafer-level fabrication process, low cost, fine pitch and high I/O density. The first type is a highly-compliant cantilevered spring interconnect for the next generation packaging and probing technology. To understand the reliability of the package with this novel compliant spring interconnect structure and the typical behavior of sliding contact, test vehicles with different orientations of the cantilevered springs (21 μm pitch) have been fabricated, assembled and subjected to thermal cycling test. In-situ resistance and temperature measurements have been conducted. The second type is a compliant free-standing interconnect, One-Turn Helix (OTH) structure. This structure is built as an one-turn strip helix in order to get good compliance in space. It can be fabricated through conventional photolithography-based IC fabrication process. Optimal design parameters have been identified for this structure taking into consideration the thermo-mechanical and electrical behavior of this unique structure.

Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging

2021 ◽  
Author(s):  
Lau Boon Long ◽  
David Ho ◽  
Lim Teck Guan ◽  
Hsiao Hsiang Yao ◽  
Lim Pei Siang ◽  
...  
Keyword(s):  
Fabrication Process ◽  
Wafer Level ◽  
Process Flow ◽  
Wafer Level Packaging

scholarly journals Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

2012 ◽  
Vol 18 (4) ◽  
pp. 467-473 ◽  
Author(s):  
Hugo Durou ◽  
David Pech ◽  
David Colin ◽  
Patrice Simon ◽  
Pierre-Louis Taberna ◽  
...  
Keyword(s):  
Specific Energy ◽  
Fabrication Process ◽  
Wafer Level ◽  
High Specific Energy
Sign in / Sign up

Export Citation Format

Share Document