A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly Using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-Compression Bonding Method

2017 ◽  
Author(s):  
Ji-Soo Lee ◽  
Ji-Hye Kim ◽  
Kyung-Wook Paik
Keyword(s):  
Conductive Films ◽  
Fine Pitch ◽  
Bonding Method

scholarly journals Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

2013 ◽  
Vol 2013 ◽  
pp. 1-10 ◽  
Author(s):  
Tae-Wan Kim ◽  
Kyung-Lim Suk ◽  
Sang-Hoon Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Polyvinylidene Fluoride ◽  
Short Circuit ◽  
Flexible Substrate ◽  
Capture Rate ◽  
Bonding Process ◽  
Conductive Films ◽  
Ultrasonic Bonding ◽  
Fine Pitch ◽  
Solder Balls ◽  
Bonding Method

In this study, solder ball incorporated polyvinylidenefluoride (PVDF) nanofiber was added into the ACF system to overcome short circuit issues of fine pitch flex-on-flex (FOF) assembly. Also, in order to improve the thermal mismatch of the flexible substrate which can lead to electrode misalignment during the bonding process, low melting temperature Sn58Bi solder balls were used with vertical ultrasonic (U/S) bonding method. When performing FOF assembly using PVDF nanofiber/Sn58Bi solder ACF and vertical ultrasonic bonding, PVDF nanofiber/Sn58Bi solder ACFs showed 34% higher solder capture rate on an electrode compared to conventional Ni ACFs and conventional Sn58Bi solder ACFs. Additionally, PVDF nanofiber/Sn58Bisolder ACFs showed 100% insulation between neighboring electrodes where conventional Ni ACFs and conventional Sn58Bi solder ACFs showed 75% and 87.5% insulation. Other electrical properties such as contact resistance and current handling capability as well as reliability test of PVDF nanofiber/Sn58Bi solder ACFs showed improved results compared to those of conventional Ni ACFs, which proves the formation of stable solder joint of PVDF nanofiber/Sn58Bi solder ACFs.

Advancements in Flip Chip Assembly Equipment and Processes

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001328-001358 ◽  
Author(s):  
Bob Chylak ◽  
Horst Clauberg ◽  
Daniel Buergi
Keyword(s):  
Flip Chip ◽  
First Generation ◽  
Standard Process ◽  
Productivity Improvement ◽  
Gate Arrays ◽  
Fine Pitch ◽  
Field Programmable ◽  
Programmable Gate Arrays ◽  
Pros And Cons ◽  
Bonding Method

High I/O devices such as microprocessors, applications processors and field programmable gate arrays have transitioned from wire bonding to flip chip interconnect as the I/O densities have increased above 2000. As the bump pitch shrinks the standard process flow for production flip chip processes is challenged. As the bump pitch continues to shrink the accuracy of standard flip chip bonders is not adequate for the fine pitch packages of tomorrow. The options to resolve this issue are extending the accuracy for standard flip chip bonders or moving the assembly of these packages to the inherently more accurate thermo-compression bonders. This paper will discuss the pros and cons of each approach along with showing data which indicates what accuracies are actually required. Although substrate manufacturers have developed low CTE designs which mitigate the warpage caused by the mismatch between the Si die and the substrate as the assembled package travels through the reflow oven, warpage at finer pitches is becoming more and more difficult to control in flip chip processes. Thermocompression (TC) bonding is seen as the next-generation packaging technology that will resolve this issue through local reflow of the solder and elimination of the reflow oven. Despite the tremendous technical and quality advantages of TC bonding, adoption has been limited by the relatively low throughput of the first generation thermocompression bonders. In this paper we describe bonding results obtained with an innovative flip chip bonding method to optimize the process to dramatically improve the throughput by applying flux directly to the substrate rather than dipping the pillars in a bath. A study of this process and comparison of various methods of accomplishing it along with their related costs are discussed in the paper. A second large productivity improvement that is promising by eliminating the need for cooling the die before transferring die that has pre-applied underfill film laminated to it is also studied with productivity models developed. Finally a unique equipment concept for managing the transition from mass reflow to thermo-compression bonding will be presented.

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