A Study on the Cu-Rod Anisotropic Conductive Films (ACFs) for Flex-on-Fabric (FOF) Interconnections Using an Ultrasonic Bonding Method

2016 ◽  
Author(s):  
Seung-Yoon Jung ◽  
Hye Eun Hong ◽  
Kyung-Wook Paik
Keyword(s):  
Conductive Films ◽  
Ultrasonic Bonding ◽  
Bonding Method

scholarly journals Low Temperature Flex-on-Flex Assembly Using Polyvinylidene Fluoride Nanofiber Incorporated Sn58Bi Solder Anisotropic Conductive Films and Vertical Ultrasonic Bonding

2013 ◽  
Vol 2013 ◽  
pp. 1-10 ◽  
Author(s):  
Tae-Wan Kim ◽  
Kyung-Lim Suk ◽  
Sang-Hoon Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Polyvinylidene Fluoride ◽  
Short Circuit ◽  
Flexible Substrate ◽  
Capture Rate ◽  
Bonding Process ◽  
Conductive Films ◽  
Ultrasonic Bonding ◽  
Fine Pitch ◽  
Solder Balls ◽  
Bonding Method

In this study, solder ball incorporated polyvinylidenefluoride (PVDF) nanofiber was added into the ACF system to overcome short circuit issues of fine pitch flex-on-flex (FOF) assembly. Also, in order to improve the thermal mismatch of the flexible substrate which can lead to electrode misalignment during the bonding process, low melting temperature Sn58Bi solder balls were used with vertical ultrasonic (U/S) bonding method. When performing FOF assembly using PVDF nanofiber/Sn58Bi solder ACF and vertical ultrasonic bonding, PVDF nanofiber/Sn58Bi solder ACFs showed 34% higher solder capture rate on an electrode compared to conventional Ni ACFs and conventional Sn58Bi solder ACFs. Additionally, PVDF nanofiber/Sn58Bisolder ACFs showed 100% insulation between neighboring electrodes where conventional Ni ACFs and conventional Sn58Bi solder ACFs showed 75% and 87.5% insulation. Other electrical properties such as contact resistance and current handling capability as well as reliability test of PVDF nanofiber/Sn58Bi solder ACFs showed improved results compared to those of conventional Ni ACFs, which proves the formation of stable solder joint of PVDF nanofiber/Sn58Bi solder ACFs.

Preparation and Characterization of the Amidoxime-Modified Polyacrylonitrile (PAN-Amidoxime) Nanofibre Composite

2014 ◽  
Vol 633-634 ◽  
pp. 30-33 ◽  
Author(s):  
Min Hu ◽  
Yu Hao Ma ◽  
Zong Jie Li ◽  
Wei Min Kang ◽  
Bo Wen Cheng
Keyword(s):  
Ir Spectra ◽  
Protective Layers ◽  
Ultrasonic Bonding ◽  
Ft Ir ◽  
Bonding Method ◽  
Amidoxime Group

In this research, a kind of nonwoven composite used for the absorption of heavy mental ions has been made. The composite was made of two layers of ES thermal bonded nonwovens as the protective layers and the PAN-amidoxime nanofibers which are prepared through the modification of electrospun PAN nanofibers as the interlayer. The composition was achieved by the ultrasonic bonding method. After the composition the PAN nanofibers were modified by grafting the amidoxime group to PAN. The results of FT-IR spectra and FE-SEM indicated that nitrile groups in PAN were partly converted into amidoxime groups and there were no serious cracks on the surface of PAN-amidoxime nanofibers. The results show that the amidoxime groups have been proved to be grafted to the PAN nanofibers with the percent grafting of 81.6%.

Thermal assisted ultrasonic bonding method for poly(methyl methacrylate) (PMMA) microfluidic devices

Talanta ◽  
2010 ◽  
Vol 81 (4-5) ◽  
pp. 1331-1338 ◽  
Author(s):  
Zongbo Zhang ◽  
Xiaodong Wang ◽  
Yi Luo ◽  
Shengqiang He ◽  
Liding Wang
Keyword(s):  
Methyl Methacrylate ◽  
Microfluidic Devices ◽  
Poly Methyl Methacrylate ◽  
Ultrasonic Bonding ◽  
Bonding Method
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