Design and demonstration of paper-thin and low-warpage single and 3D organic packages with chip-last embedding technology for smart mobile applications
2016 ◽
Vol 3
(6)
◽
pp. 582-592
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Keyword(s):
2019 ◽
Vol 3
(2)
◽
pp. 5-13
Keyword(s):
2014 ◽
Vol 32
◽
pp. 253-260
◽
Keyword(s):
Keyword(s):
2018 ◽
Vol 7
(2.7)
◽
pp. 159