Detection of solder joint failure precursors on tin-lead and lead-free assemblies using RF impedance analysis

2009 ◽  
Author(s):  
Daeil Kwon ◽  
Michael H. Azarian ◽  
Michael Pecht
Keyword(s):  
Solder Joint ◽  
Impedance Analysis ◽  
Lead Free ◽  
Joint Failure ◽  
Failure Precursors

scholarly journals Lead-free Solder Joint Reliability – State of the Art and Perspectives

2005 ◽  
Vol 2 (1) ◽  
pp. 72-83 ◽  
Author(s):  
Jianbiao Pan ◽  
Jyhwen Wang ◽  
David M. Shaddock
Keyword(s):  
Solder Joint ◽  
Electronics Industry ◽  
Lead Free ◽  
Lead Free Solder ◽  
Joint Failure ◽  
Solder Joint Reliability ◽  
Electronic Products ◽  
Joint Reliability ◽  
Free Solder ◽  
Lead Free Solders

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for several years. Although currently there are no specific regulations banning lead in electronics devices in the United States, many companies and consortiums are working on lead-free solder initiatives including Intel, Motorola, Agilent Technologies, General Electric, Boeing, NEMI and many others to avoid a commercial disadvantage. The solder joints reliability not only depends on the solder joint alloys, but also on the component and PCB metallizations. Reflow profile also has significant impact on lead-free solder joint performance because it influences wetting and microstructure of the solder joint. A majority of researchers use temperature cycling for accelerated reliability testing since the solder joint failure mainly comes from thermal stress due to CTE mismatch. A solder joint failure could be caused by crack initiation and growth or by macroscopic solder facture. There are conflicting views of the reliability comparison between lead-free solders and tin-lead solders. This paper first reviews lead-free solder alloys, lead-free component lead finishes, and lead-free PCB surface finishes. The issue of tin whiskers is also discussed. Next, lead-free solder joint testing methods are presented; finite element modeling of lead-free solder joint reliability is reviewed; and experimental data comparing lead-free and tin-lead solder joint reliability are summarized. Finally the paper gives perspectives of transitions to totally lead-free manufacturing.

Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint

2004 ◽  
Author(s):  
Norman J. Armendariz ◽  
Prawin Paulraj
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Gold Surface ◽  
Circuit Board ◽  
Lead Free ◽  
Processing Temperature ◽  
The European Union ◽  
Printed Circuit ◽  
Higher Temperature ◽  
Tin Silver Copper

Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI) to attach to a printed circuit board (PCB) and survive various assembly and reliability test conditions for end-use deployment. Intel is pro-actively preparing for this anticipated Pb ban, by evaluating a new lead free (LF) solder alloy in the ternary Tin- Silver-Copper (Sn4.0Ag0.5Cu) system and developing higher temperature board assembly processes. This will be pursued with a focus on achieving the lowest process temperature required to avoid deleterious higher temperature effects and still achieve a metallurgically compatible solder joint. One primary factor is the elevated peak reflow temperature required for surface mount technology (SMT) LF assembly, which is approximately 250 °C compared to present eutectic tin/lead (Sn37Pb) reflow temperatures of around 220 °C. In addition, extended SMT time-above-liquidus (TAL) and subsequent cooling rates are also a concern not only for the critical BGA chipsets and CPU BGA sockets but to other components similarly attached to the same PCB substrate. PCBs used were conventional FR-4 substrates with organic solder preservative on the copper pads and mechanical daisychanged FCBGA components with direct immersion gold surface finish on their copper pads. However, a materials analysis method and approach is also required to characterize and evaluate the effect of low peak temperature LF SMT processing on the PBA SLI to identify the absolute limits or “cliffs” and determine if the minimum processing temperature and TAL could be further lowered. The SLI system is characterized using various microanalytical techniques, such as, conventional optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and microhardness testing. In addition, the SLI is further characterized using macroanalytical techniques such as dye penetrant testing (DPT) with controlled tensile testing for mechanical strength in addition to disbond and crack area mapping to complete the analysis.

Impact reliability estimation of lead free solder joint with IMC layer

2009 ◽  
Vol 517 (14) ◽  
pp. 4255-4259 ◽  
Author(s):  
Jong-Min Kim ◽  
Seung-Wan Woo ◽  
Yoon-Suk Chang ◽  
Young-Jin Kim ◽  
Jae-Boong Choi ◽  
...  
Keyword(s):  
Solder Joint ◽  
Reliability Estimation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
D. N. Borza ◽  
I. T. Nistea
Keyword(s):  
Solder Joint ◽  
Fundamental Frequency ◽  
Printed Circuit Board ◽  
Speckle Interferometry ◽  
Circuit Board ◽  
Joint Failure ◽  
Printed Circuit ◽  
Out Of Plane ◽  
Fringe Patterns ◽  
Board Level

Reliability of electronic assemblies at board level and solder joint integrity depend upon the stress applied to the assembly. The stress is often of thermomechanical or of vibrational nature. In both cases, the behavior of the assembly is strongly influenced by the mechanical boundary conditions created by the printed circuit board (PCB) to casing fasteners. In many previously published papers, the conditions imposed to the fasteners are mostly aiming at an increase of the fundamental frequency and a decrease of static or dynamic displacement values characterizing the deformation. These conditions aim at reducing the fatigue in different parts of these assemblies. In the photomechanics laboratory of INSA Rouen, the origins of solder joint failure have been investigated by means of full-field measurements of the flexure deformation induced by vibrations or by forced thermal convection. The measurements were done both at a global level for the whole printed circuit board assembly (PCBA) and at a local level at the solder joints where failure was reported. The experimental technique used was phase-stepped laser speckle interferometry. This technique has a submicrometer sensitivity with respect to out-of-plane deformations induced by bending and its use is completely nonintrusive. Some of the results were comforted by comparison with a numerical finite elements model. The experimental results are presented either as time-average holographic fringe patterns, as in the case of vibrations, or as wrapped phase patterns, as in the case of deformation under thermomechanical stress. Both types of fringe patterns may be processed so as to obtain the explicit out-of-plane static deformation (or vibration amplitude) maps. Experimental results show that the direct cause of solder joint failure may be a high local PCB curvature produced by a supplementary fastening screw intended to reduce displacements and increase fundamental frequency. The curvature is directly responsible for tensile stress appearing in the leads of a large quad flat pack (QFP) component and for shear in the corresponding solder joints. The general principle of increasing the fundamental frequency and decreasing the static or dynamic displacement values has to be checked against the consequences on the PCB curvature near large electronic devices having high stiffness.

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

2016 ◽  
Vol 46 (3) ◽  
pp. 1674-1682 ◽  
Author(s):  
Yan Li ◽  
Olen Hatch ◽  
Pilin Liu ◽  
Deepak Goyal
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Root Cause ◽  
Free Solder

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

2011 ◽  
Author(s):  
Kanji Takagi ◽  
Masaki Wakabayashi ◽  
Junichi Inoue ◽  
Qiang Yu ◽  
Takahiro Akutsu
Keyword(s):  
Thermal Conductivity ◽  
Solder Joint ◽  
Rupture Life ◽  
Metal Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Insulating Layer ◽  
Heating Device ◽  
Propagation Analysis ◽  
Free Solder

This paper proposes the high reliable design method for lead-free solder joint on metal substrate on chip component. First, the crack propagation analysis method for estimating rupture life of solder joint was constructed. And then, the effect of material properties of insulating layer on metal substrate and solder joint shape for rupture life of solder joint was evaluated using crack propagation analysis. As the result, the relation between young’s modulus of insulating layer and rupture life was indicated quantitatively. Also, the relation of filet length for rupture life of solder joint was evaluated. Secondary, evaluation method of heat dissipation for metal substrate was proposed. Because thermal conductivity of insulating layer affects temperature rise of heating device. And, the relation between thermal conductivity of insulating layer and temperature rise of heating device was indicated.

Vibration Fatigue Reliability of Lead and Lead-Free Solder Joint by FORM/SORM

2007 ◽  
Vol 345-346 ◽  
pp. 1393-1396
Author(s):  
Ouk Sub Lee ◽  
Man Jae Hur ◽  
Yeon Chang Park ◽  
Dong Hyeok Kim
Keyword(s):  
Solder Joint ◽  
Failure Probability ◽  
Lead Free ◽  
Lead Free Solder ◽  
Fatigue Reliability ◽  
Probability Models ◽  
First Order ◽  
Reliability Method ◽  
Vibration Fatigue ◽  
Free Solder

It is well-known that the vibration significantly affect the life of solder joint. In this paper, the effects of the vibration on the failure probability of the solder joint are studied by using the failure probability models such as the First Order Reliability Method (FORM) and the Second Order Reliability Method (SORM). The accuracies of the results are estimated by a help of the Monte Carlo Simulation (MCS). The reliability of the lead and the lead-free solder joint was also evaluated. The reliability of lead-free solder joint is found to be higher than that of lead solder joint.

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