The hybrid curing adhesive for image sensor module

2008 ◽  
Author(s):  
Yukinari Abe ◽  
Kazuki Iwaya
Keyword(s):  
Image Sensor ◽  
Sensor Module ◽  
Hybrid Curing

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

Advanced Reconnaissance Image Sensor Module

1988 ◽  
Author(s):  
A. Lareou ◽  
J. Dillon ◽  
G. Martini
Keyword(s):  
Image Sensor ◽  
Reconnaissance Image ◽  
Sensor Module
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