Characterization of board level reliability of a system with flip chip HITCE BGA package through modeling and testing

2008 ◽  
Author(s):  
Ron Zhang
Keyword(s):  
Flip Chip ◽  
Bga Package ◽  
Board Level ◽  
Board Level Reliability

Low-K Flip Chip Board Level Reliability on 65nm Technology

2007 ◽  
Author(s):  
Pei-Haw Tsao ◽  
Bill Kiang ◽  
Kenneth Wu ◽  
Abel Chang ◽  
Tsorng-Dih Yuan
Keyword(s):  
Flip Chip ◽  
Board Level ◽  
Board Level Reliability ◽  
Low K

Package Qualification Envelope for 22FDX® Technology

2019 ◽  
Vol 2019 (1) ◽  
pp. 000169-000175
Author(s):  
Christian Klewer ◽  
Frank Kuechenmeister ◽  
Jens Paul ◽  
Dirk Breuer ◽  
Bjoern Boehme ◽  
...  
Keyword(s):  
Flip Chip ◽  
Silicon On Insulator ◽  
Wafer Level ◽  
Characterization Methods ◽  
Fully Depleted ◽  
Individual Market ◽  
The Individual ◽  
Key Aspects ◽  
Board Level ◽  
Board Level Reliability

Abstract This article describes the methodology used to derive the 22FDX® Fully-Depleted Silicon-On-Insulator (FDSOI) Chip Package Interaction (CPI) qualification envelope. In the first part it is discussed how the individual market segments influence the technology features and offerings, including BEOL stacks and package types. In the following, the criteria used for the selection of BEOL stacks, die and package sizes and the interconnect type for the qualification envelope are summarized and explained. The three CPI qualification stages and related characterization methods are presented. CPI test structures used in the envelope are reported and their placement on the technology qualification vehicles (TQV) is outlined on the basis of flip chip TQV. Finally, the paper presents the passing 22FDX® package and board level reliability results obtained for wire bond, flip chip, as well as wafer level fan-in and fan-out package technologies. Key aspects of the individual qualifications are reported.

Lead Free Flip Chip Reliability for Various Package Types

2011 ◽  
Author(s):  
Nokibul Islam ◽  
Miguel Jimarez ◽  
Ahmer Syed ◽  
TaeKyeong Hwang ◽  
JaeYun Gim ◽  
...  
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Large Body ◽  
Temperature Cycle ◽  
Molding Compound ◽  
Board Level ◽  
Board Level Reliability

Flip Chip (FC) technology has now become the mainstream solution for high performance packages. From commercial gaming machines to high reliability servers, the FC package is gaining more market share over traditional packaging technologies, such as wire bond. Extensive research has been carried out to make the flip chip more robust, smaller foot prints, and excellent performance. FC packages are fabricated typically in two main configurations. Bare die FC packages leave the non active side of the die exposed. This allows the customer to apply their preferred heat dissipation scheme during board level attach. Lidded FC packages use a metallic lid attached to the die. Bare die package can be further subdivided into bare die underfilled package and bare die flip chip molded ball grid array (FCmBGA) package. Each of these packaging configurations has advantages as well as disadvantages. FCmBGA uses molding compound or EMC instead of capillary underfill, to protect FC die, and eliminate the need for a lid. Package warpage reduced a lot by adding a lid with the bare die FC package. However, the package and board level reliability for the above package types are still debatable. In this study test vehicles with three package types with bumps and BGAs are daisy chain to measure in situ data during accelerated tests. Impact of standard vs. low CTE (coefficient of thermal expansion) core substrate, accelerated temperature cycle conditions (temperature cycle condition “B”, “H”, and “J” according to JEDEC), and package level vs. package mounted on the board level reliability will be investigated. Comprehensive reliability data will help to select the right package type for next generation large die large body flip chip application.

Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 ◽  
Author(s):  
Nishant Lakhera ◽  
Burt Carpenter ◽  
Trung Duong ◽  
Mollie Benson ◽  
Andrew J Mawer
Keyword(s):  
Radar Applications ◽  
Board Level ◽  
Board Level Reliability

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

Sign in / Sign up

Export Citation Format

Share Document