Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications

2008 ◽  
Author(s):  
Hongjin Jiang ◽  
Kyoung-sik Moon ◽  
C. P. Wong
Keyword(s):  
Low Temperature ◽  
Copper Alloy ◽  
Lead Free ◽  
Silver Copper ◽  
Tin Silver Copper

The Application of Novel Platinum-Reinforced Tin-Silver-Copper Solder to Bifacial Photovoltaic Module for Improvement of Yield and Reliability

2014 ◽  
Vol 136 (4) ◽  
Author(s):  
Chin Kim Lo ◽  
Yun Seng Lim ◽  
Mee Chu Wong ◽  
Yee Kai Tian
Keyword(s):  
Solar Cells ◽  
Solder Joint ◽  
Lead Free ◽  
Energy Yield ◽  
Substantial Impact ◽  
Snagcu Solder ◽  
Silver Copper ◽  
Pv Module ◽  
Pv Modules ◽  
Tin Silver Copper

The characteristics of solder joints between the busbars of solar cells and copper ribbons can affect the performance of a photovoltaic (PV) module significantly. The resistivity of the joints and the intermetallic compound structures within the joints are the two main characteristics that impose a substantial impact on the yield and the reliability of the PV module. In this paper, we aim to present and analyze a novel platinum-reinforced tin-silver-copper (Sn-3.8Ag-0.7Cu-0.2Pt) as the lead-free solder material to connect copper ribbons to the metallization of bifacial solar cells. The performance of the PV module using platinum-reinforced solder is investigated by constructing two bifacial PV modules using the popular lead-free Sn-3.8Ag-0.7Cu solder and Sn-3.8Ag-0.7Cu-0.2Pt solder, respectively. Micrographs of the joints are obtained to show that the platinum-reinforced solder joint has fewer voids and a more evenly distributed and thinner intermetallic layer than that of a conventional SnAgCu solder joint. As a result, the physical attachment between the busbars and the ribbon using SnAgCuPt solder is stronger than that using SnAgCu solder. The power outputs of both PV modules are measured together with two commercial PV modules under the sun using an IV plotter. The results show that the total energy yield of the bifacial PV module with the new solder is about 6–10% higher than that with the conventional SnAgCu solder. The energy yield of the bifacial PV module using SnAgCuPt solder is 35.8% and 0.2% higher than that of the commercially available monofacial polycrystalline and monocrystalline PV modules, respectively.

scholarly journals A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

2019 ◽  
Vol 32 (2) ◽  
pp. 115-126 ◽  
Author(s):  
Muhammad Aamir ◽  
Riaz Muhammad ◽  
Majid Tolouei-Rad ◽  
Khaled Giasin ◽  
Vadim V. Silberschmidt
Keyword(s):  
Carbon Nanotubes ◽  
Good Alternative ◽  
Global Market ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Content Type ◽  
Silver Copper ◽  
Free Solder ◽  
Tin Silver Copper

Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

The Effect of Multiple Reflow Times on Lead-Free Solder Joint Microstructure

2003 ◽  
Author(s):  
Sami T. Nurmi ◽  
Janne J. Sundelin ◽  
Eero O. Ristolainen ◽  
Toivo K. Lepisto¨
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Snagcu Solder ◽  
Silver Copper ◽  
Free Solder ◽  
Tin Silver Copper ◽  
Lead Free Solders

As environmental issues are raising more interest and are becoming crucial factors in all parts of the world, more and more environmental-friendly electronics products are emerging. Usually this means the introduction of products with lead-free solders. However, the reliability of lead-free solders is still a serious concern despite the vast research done in this field. This paper will describe the interconnect reliability of three kinds of solder joints respectively prepared with lead-free solder paste and lead-free PBGA components, lead-free solder paste and tin-lead-silver PBGA components, and tin-lead solder paste and tin-lead-silver PBGA components. Lead-free and tin-lead solders were composed of eutectic tin-silver-copper and tin-lead, respectively. In addition, the study also presents the effect of multiple reflow times. The study focuses on the microstructures of different assemblies. The particular interest is on the assemblies soldered with lead-free solder paste and tin-lead-silver PBGA components, since the SnPbAg solder on the bumps of the PBGA components were exposed to the reflow profile meant for the lead-free SnAgCu solder. Thus, these SnPbAg solder bumps were in the molten state almost twice as long as the rest of the solders. This had a notable effect on the reliability of these solder joints as we will be showing later in this paper. The test boards were temperature-cycled for 2500 cycles between −40 and +125°C (a 30-minute cycle). PBGA solder joint failures were monitored with a real time monitoring system. Optical and scanning electron microscopy was used to inspect the broken solder joints and their microstructure. The results of tests indicate that the number of reflow times can significantly affect the lifetime of PBGA solder joints. The most notable changes can be seen in the solder joints made with tin-lead-silver PBGA components and tin-silver-copper solder paste soldered with a lead-free reflow profile. The general trend was that the reliability of the solder joints increased in proportion to the number of reflow times. Mainly two factors are believed to have the major effect on the reliability of PBGA solder joints, voids, and microstructural changes in solder.

COPPER ALLOY No. 510

Alloy Digest ◽  
1971 ◽  
Vol 20 (8) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Low Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Copper Alloy ◽  
High Strength ◽  
Heat Treating ◽  
Fatigue Properties ◽  
Temperature Performance ◽  
Tin Bronze

Abstract COPPER ALLOY No. 510 is a tin bronze containing about 0.25% phosphorus. It combines high strength and toughness with excellent fatigue properties. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep and fatigue. It also includes information on low temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-238. Producer or source: Brass mills.

Materials Characterization of Lead Free Compositions for Minimum Temperature SMT Processes at the SLI-Second Level Interconnect Solder Joint

2004 ◽  
Author(s):  
Norman J. Armendariz ◽  
Prawin Paulraj
Keyword(s):  
Solder Joint ◽  
Printed Circuit Board ◽  
Gold Surface ◽  
Circuit Board ◽  
Lead Free ◽  
Processing Temperature ◽  
The European Union ◽  
Printed Circuit ◽  
Higher Temperature ◽  
Tin Silver Copper

Abstract The European Union is banning the use of Pb in electronic products starting July 1st, 2006. Printed circuit board assemblies or “motherboards” require that planned CPU sockets and BGA chipsets use lead-free solder ball compositions at the second level interconnections (SLI) to attach to a printed circuit board (PCB) and survive various assembly and reliability test conditions for end-use deployment. Intel is pro-actively preparing for this anticipated Pb ban, by evaluating a new lead free (LF) solder alloy in the ternary Tin- Silver-Copper (Sn4.0Ag0.5Cu) system and developing higher temperature board assembly processes. This will be pursued with a focus on achieving the lowest process temperature required to avoid deleterious higher temperature effects and still achieve a metallurgically compatible solder joint. One primary factor is the elevated peak reflow temperature required for surface mount technology (SMT) LF assembly, which is approximately 250 °C compared to present eutectic tin/lead (Sn37Pb) reflow temperatures of around 220 °C. In addition, extended SMT time-above-liquidus (TAL) and subsequent cooling rates are also a concern not only for the critical BGA chipsets and CPU BGA sockets but to other components similarly attached to the same PCB substrate. PCBs used were conventional FR-4 substrates with organic solder preservative on the copper pads and mechanical daisychanged FCBGA components with direct immersion gold surface finish on their copper pads. However, a materials analysis method and approach is also required to characterize and evaluate the effect of low peak temperature LF SMT processing on the PBA SLI to identify the absolute limits or “cliffs” and determine if the minimum processing temperature and TAL could be further lowered. The SLI system is characterized using various microanalytical techniques, such as, conventional optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and microhardness testing. In addition, the SLI is further characterized using macroanalytical techniques such as dye penetrant testing (DPT) with controlled tensile testing for mechanical strength in addition to disbond and crack area mapping to complete the analysis.

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