New insulation material with flat-surface, low coefficient of thermal expansion, low-dielectric-loss for next generation semiconductor packages

2008 ◽  
Author(s):  
M. Sugimura ◽  
H. Imai ◽  
M. Kawasaki ◽  
K. Kamata ◽  
K. Fujii ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Dielectric Loss ◽  
Flat Surface ◽  
Coefficient Of Thermal Expansion ◽  
Insulation Material ◽  
Next Generation ◽  
Low Dielectric ◽  
Semiconductor Packages

Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface Roughness

2011 ◽  
Vol 2011 (1) ◽  
pp. 000813-000819
Author(s):  
Eita HORIKI ◽  
Isao SUZUKI ◽  
Toshiaki TANAKA ◽  
Akihiro UENISHI ◽  
Hiroshi KOUYANAGI
Keyword(s):  
Surface Roughness ◽  
Dielectric Loss ◽  
Loss Tangent ◽  
Dielectric Loss Tangent ◽  
High Frequency ◽  
Transmission Loss ◽  
Coefficient Of Thermal Expansion ◽  
Electrical Insulation ◽  
Insulation Material ◽  
Low Dielectric

With the increasing speed of information and communication equipments in recent years, together with the high-speed signal processing of LSIs, there is a requirement for build-up electrical insulation materials (used in IC package substrates) to have low-dielectric loss tangent which reduces dielectric loss so as to achieve low transmission loss in the high-frequency GHz bands. At the same time, there is an increasing need for materials to have low-CTEs (Coefficient of Thermal Expansion) so as to ensure highly reliable substrates. With ou formulation technology, we have developed a next-generation film-shaped build-up electrical insulation material compatible with high-frequency signal transmission by using a composition of practical thermosetting epoxy resin, which has realized both a low-dielectric loss tangent and at the same time, a low-CTE. In addition, this material can show a low-surface roughness after the film desmear process. It is thus expected to help reduce not only dielectric loss by means of a low-dielectric loss tangent, but also conductor loss caused by the skin effect, and will promote fine line formation by means of SAP (Semi Additive Process).

scholarly journals MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications

Polymers ◽  
2020 ◽  
Vol 12 (9) ◽  
pp. 1875
Author(s):  
Jianming Guo ◽  
Hao Wang ◽  
Caixia Zhang ◽  
Qilong Zhang ◽  
Hui Yang
Keyword(s):  
Dielectric Loss ◽  
High Frequency ◽  
Composite Laminates ◽  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
Weight Ratio ◽  
Resin Matrix ◽  
Ceramic Powders ◽  
Low Dielectric ◽  
Low Dissipation

Copper clad laminates (CCLs) with low dissipation factor (Df) are urgently needed in the fields of high-frequency communications devices. A novel resin matrix of modified poly (2,6-dimethyl-1,4-phenylene ether) (MPPE) and styrene-ethylene/butylene-styrene (SEBS) was employed in the fabrication of high-frequency copper clad laminates (CCLs). The composites were reinforced by E-glass fabrics, which were modified with phenyltriethoxysilane (PhTES). The composite laminates obtained exhibited impressive dielectric loss of 0.0027 at 10 GHz when the weight ratio of MPPE to SEBS was 5:1. In order to modify the dielectric constant (Dk), coefficient of thermal expansion (CTE) and other performances of laminates, Li2TiO3 (LT) ceramic powders were introduced into the resin matrix. The composite laminates showed low dielectric loss of 0.0026 at 10 GHz and relatively high flexural strength of 125 MPa when the mass ratio of LT fillers to resin is 0.4. Moreover, the composite laminates all maintain low water uptake (<0.5%). The microstructure and thermal properties of composite laminates filled with LT ceramic powders were also tested. These results show that copper clad laminates prepared with modified polyphenylene ether (MPPE)/SEBS and LT ceramic fillers have strong competitiveness to fabricate printed circuit boards (PCBs) for high-frequency and high-speed applications.

scholarly journals High-Speed Signaling Interconnects Using Flat-Surface and Low-Dielectric-Loss Resin

2006 ◽  
Vol 9 (4) ◽  
pp. 262-268 ◽  
Author(s):  
Akihiro MORIMOTO ◽  
Masahiko SUGIMURA ◽  
Atsushi KAWATA ◽  
Masafumi KAWASAKI ◽  
Yasuhiro WAKIZAKA ◽  
...  
Keyword(s):  
Dielectric Loss ◽  
High Speed ◽  
Flat Surface ◽  
Low Dielectric

scholarly journals Polyimide/mica hybrid films with low coefficient of thermal expansion and low dielectric constant

e-Polymers ◽  
2019 ◽  
Vol 19 (1) ◽  
pp. 181-189 ◽  
Author(s):  
Wei Zhao ◽  
Yong Xu ◽  
Chaoran Song ◽  
Jian Chen ◽  
Xiaohong Liu
Keyword(s):  
Dielectric Constant ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Low Dielectric Constant ◽  
Gravimetric Analysis ◽  
Condensation Polymerization ◽  
Hybrid Films ◽  
Low Dielectric ◽  
Infrared Spectrometer ◽  
Polyimide Matrix

AbstractPolyimide (PI)/mica hybrid films were successfully prepared by in situ condensation polymerization method, in which the mica particles were modified by coupling agent γ-aminopropyltriethoxy silane (APTS) to strengthen the interaction between the mica particles and PI matrix. The morphology, structure, thermal and mechanical properties as well as dielectric properties of PI films were systematically studied via Scanning electron microscope (SEM), Fourier transform infrared spectrometer (FT-IR spectrometer), Thermal gravimetric analysis (TGA), tensile experiments, Thermal mechanical analyzer (TMA), impedance analyzer, etc. The results indicated that the mica particles were dispersed homogeneously in PI matrix, leading to an improvement of the mechanical property, thermal stability and hydrophobicity. It was novel to notice that hybrid films exhibited low coefficient of thermal expansion (CTE) and low dielectric constant simultaneously. The CTE and dielectric constant of hybrid film dropped to 25.36 ppm/k and 2.42 respectively, in the presence of 10 wt% mica into polyimide matrix.

New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

2015 ◽  
Author(s):  
Yukio Nakamura ◽  
Kenichi Oohashi ◽  
Koji Morita ◽  
Shuji Nomoto ◽  
Takayuki Suzuki ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Mobile Devices ◽  
Coefficient Of Thermal Expansion ◽  
Core Material ◽  
Resin System ◽  
High Modulus ◽  
Next Generation ◽  
Treatment Technology ◽  
Main Factor ◽  
Core Materials

The thinner and higher density PKG (package) is being required strongly for the growth of smaller mobile devices. Especially, package on package technology (PoP) has become a mainstream for application processors which are installed in smartphones and tablets. However, the warpage of thinner PKG often causes a problem at the chip mounting process. The main factor of warpage is the mismatch of CTE (coefficient of thermal expansion) between substrate and chip. Therefore, the lower CTE core materials are needed for the thinner PKG. Recently, Hitachi Chemical has developed the super-low CTE material, core and prepreg, applying our new resin system and filler treatment technology, and placed it on the market. Furthermore, a super-low CTE material of 0.7 ppm/K is currently under development. The super-low CTE material shows the best warpage performance in our low CTE core material lineups, maintaining its higher Tg, high modulus and low Dk/Df values.

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