scholarly journals RF and DC power handling characterization of thin film resistors embedded on LCP

2008 ◽  
Author(s):  
George E. Ponchak ◽  
Jennifer L. Jordan ◽  
Stephen Horst ◽  
John Papapolymerou
Keyword(s):  
Thin Film ◽  
Dc Power ◽  
Power Handling ◽  
Thin Film Resistors

Characterization of Tantalum Nitride Thin Films Deposited on SiO[sub 2]∕Si Substrates Using dc Magnetron Sputtering for Thin Film Resistors

2006 ◽  
Vol 153 (2) ◽  
pp. G164 ◽  
Author(s):  
Nguyen Duy Cuong ◽  
Dong-Jin Kim ◽  
Byoung-Don Kang ◽  
Chang Soo Kim ◽  
Kwang-Min Yu ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Magnetron Sputtering ◽  
Tantalum Nitride ◽  
Dc Magnetron Sputtering ◽  
Si Substrates ◽  
Thin Film Resistors

High Cooling Power Density of SiGe/Si Superlattice Microcoolers

2001 ◽  
Vol 691 ◽  
Author(s):  
Gehong Zeng ◽  
Xiaofeng Fan ◽  
Chris LaBounty ◽  
John E. Bowers ◽  
Edward Croke ◽  
...  
Keyword(s):  
Thin Film ◽  
Power Density ◽  
Room Temperature ◽  
Density Measurement ◽  
Thermionic Emission ◽  
Cooling Power ◽  
Thin Film Resistors ◽  
Fabrication And Characterization ◽  
Superlattice Structures

ABSTRACTFabrication and characterization of SiGe/Si superlattice microcoolers integrated with thin film resistors are described. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity, and by providing selective emission of hot carriers through thermionic emission. Thin film metal resistors were integrated on top of the cooler devices and they were used as heat load for cooling power density measurement. Various device sizes were characterized. Net cooling over 4.1 K and a cooling power density of 598 W/cm2 for 40 × 40 μm2 devices were measured at room temperature.

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