Thermomechanical reliability study of flip-chip solder bumps: Using laser ultrasound technique and finite element method

2008 58th Electronic Components and Technology Conference ◽

10.1109/ectc.2008.4550036 ◽

2008 ◽

Cited By ~ 4

Author(s):

Jin Yang ◽

I. Charles Ume

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Laser Ultrasound ◽

Reliability Study ◽

Ultrasound Technique ◽

Solder Bumps ◽

Thermomechanical Reliability ◽

Element Method

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Thermomechanical Reliability Study of Flip Chip Solder Bumps: Using Laser Ultrasound Technique and Finite Element Method

IEEE Transactions on Advanced Packaging ◽

10.1109/tadvp.2009.2025889 ◽

2009 ◽

Vol 32 (4) ◽

pp. 729-739 ◽

Cited By ~ 6

Author(s):

Jin Yang ◽

I.C. Ume

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Laser Ultrasound ◽

Reliability Study ◽

Ultrasound Technique ◽

Solder Bumps ◽

Thermomechanical Reliability ◽

Element Method

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Reliability analysis of flip chip packages using contact finite element method

Journal of the Chinese Institute of Engineers ◽

10.1080/02533839.2004.9670861 ◽

2004 ◽

Vol 27 (2) ◽

pp. 165-172 ◽

Cited By ~ 2

Author(s):

Chun‐Te Lin ◽

Kuo‐Ning Chiang

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Reliability Analysis ◽

Flip Chip ◽

Element Method

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Finite Element Method Analysis of Evaluation of Surface Micro Cracks Using Laser Ultrasound Generated by Phase Velocity Scanning Method

Japanese Journal of Applied Physics ◽

10.1143/jjap.42.3184 ◽

2003 ◽

Vol 42 (Part 1, No. 5B) ◽

pp. 3184-3188 ◽

Cited By ~ 7

Author(s):

Harumichi Sato ◽

Hisato Ogiso ◽

Kazushi Yamanaka

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Phase Velocity ◽

Laser Ultrasound ◽

Finite Element Method Analysis ◽

Scanning Method ◽

Micro Cracks ◽

Method Analysis ◽

Element Method

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Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

1997 Proceedings 47th Electronic Components and Technology Conference ◽

10.1109/ectc.1997.606158 ◽

2002 ◽

Cited By ~ 24

Author(s):

D.W. Peterson ◽

J.N. Sweet ◽

S.N. Burchett ◽

A. Hsia

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Test Chip ◽

Flip Chip Assembly ◽

Element Method

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Finite Element Method (FEM) simulation based analysis for optimal chip layout of a 2.5D flip chip package

2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) ◽

10.1109/s3s.2018.8640160 ◽

2018 ◽

Author(s):

Manish Nayini ◽

David Questad ◽

Mukta Farooq

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Fem Simulation ◽

Simulation Based ◽

Element Method

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622 Evaluation of Flip Chip Joint Using Finite Element Method

The Proceedings of The Computational Mechanics Conference ◽

10.1299/jsmecmd.2006.19.307 ◽

2006 ◽

Vol 2006.19 (0) ◽

pp. 307-308

Author(s):

Eiichi YAMADA ◽

Masazumi AMAGAI

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Element Method

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Thermomechanical reliability assessment in SM- and COB-technology by combined experimental and finite element method

Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 ◽

10.1109/relphy.1994.307799 ◽

1994 ◽

Cited By ~ 6

Author(s):

R. Dudek ◽

B. Michel

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Reliability Assessment ◽

Thermomechanical Reliability ◽

Element Method

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Reliability study of beam and plate structures based on stochastic finite element method

2010 International Conference on Mechanical and Electrical Technology ◽

10.1109/icmet.2010.5598456 ◽

2010 ◽

Author(s):

Yongmei Zhu ◽

Chengtao Li

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Stochastic Finite Element Method ◽

Stochastic Finite Element ◽

Reliability Study ◽

Plate Structures ◽

Element Method

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Thermal performance of flip chip using finite element method

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689515 ◽

2002 ◽

Author(s):

A.Q. Yasir ◽

D.M. Pereira ◽

A.Y. Hassan ◽

K.N. Seetharamu

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Thermal Performance ◽

Flip Chip ◽

Element Method

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Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

10.2172/463650 ◽

1996 ◽

Cited By ~ 2

Author(s):

D.W. Peterson ◽

J.N. Sweet ◽

S.N. Burchett ◽

A. Hsia

Keyword(s):

Finite Element Method ◽

Finite Element ◽

Flip Chip ◽

Test Chip ◽

Flip Chip Assembly ◽

Element Method

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