The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints

Author(s):  
B. Arfaei ◽  
Y. Xing ◽  
J. Woods ◽  
J. Wolcott ◽  
P. Tumne ◽  
...  
2016 ◽  
Vol 138 (2) ◽  
Author(s):  
Sa'd Hamasha ◽  
Peter Borgesen

The behavior of lead-free solder alloys under realistic service conditions is still not well understood. Life prediction of solder joints relies on conducting accelerated tests and extrapolating results to service conditions. This can be very misleading without proper constitutive relations and without understanding the effects of cycling parameter variations common under realistic service conditions. It has been shown that the fatigue life depends on the inelastic work accumulation, independently of cycling-induced material property variations, which explains the breakdown of damage accumulation rules and allows the development of a modified Miner's rule. This paper discusses the interacting effects of strain rate and amplitude variations on solder joint fatigue life. Individual SnAgCu solder joints with two different Ag contents (SAC305 and SAC105) were tested in low cycling shear fatigue under single and varying amplitudes with different strain rates. Such a shear fatigue experiment allows the measurement of work accumulation and the evolution of solder deformation properties during cycling. The results showed that cycling with a lower strain rate at fixed amplitude causes more damage per cycle. Alternating between mild amplitude at a high strain rate and harsh amplitude at a low strain rate leads to ongoing increases in the rate of damage at the mild amplitude and thus relatively rapid failure. In comparing SAC305 with SAC105, the effect of strain rate on both alloys is almost the same, and SAC305 is still more fatigue resistant than SAC105 in varying amplitude cycling with any strain rate.


2014 ◽  
Vol 10 (3) ◽  
pp. 645-647 ◽  
Author(s):  
Liang Zhang ◽  
Xi-ying Fan ◽  
Yong-huan Guo ◽  
Cheng-wen He

Author(s):  
Raed Al Athamneh ◽  
Dania Bani Hani ◽  
Haneen Ali ◽  
Sa'D Hamasha

1992 ◽  
Vol 114 (2) ◽  
pp. 104-108 ◽  
Author(s):  
Z. Mei ◽  
J. W. Morris

This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with three different initial microstructures by quenching, air-cooling, and furnace-cooling. The test results show that the quench-solidified solder joints have isothermal fatigue lives of about twice long as those of the furnace cooled solder joints tested at 20°C and 65°C with the straining rates of about 10−4 per s. These results are ascribed to the refined grain size and less lamellar phase morphology that results on increasing the cooling rate.


2014 ◽  
Vol 597 ◽  
pp. 219-224 ◽  
Author(s):  
Liang Zhang ◽  
Ji-guang Han ◽  
Yong-huan Guo ◽  
Cheng-wen He

Sign in / Sign up

Export Citation Format

Share Document