Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies
2007 ◽
Vol 183
(1)
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pp. 6-12
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2017 ◽
Vol 841
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pp. 012014
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2020 ◽
Vol 9
(3)
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pp. 5533-5541
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2010 ◽
Vol 2010.7
(0)
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pp. 273-274
2012 ◽
Vol 78
(793)
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pp. 1314-1324
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2019 ◽
Vol 893
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pp. 1-5
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