Wafer Level Thin Film Encapsulation for BAW RF MEMS

2007 ◽  
Author(s):  
J.L. Pornin ◽  
C. Gillot ◽  
G. Parat ◽  
F. Jacquet ◽  
E. Lagoutte ◽  
...  
Keyword(s):  
Thin Film ◽  
Rf Mems ◽  
Wafer Level ◽  
Thin Film Encapsulation

Wafer-level thin-film encapsulation for MEMS

2009 ◽  
Vol 86 (4-6) ◽  
pp. 1311-1313 ◽  
Author(s):  
Conor O’Mahony ◽  
Martin Hill ◽  
Zbigniew Olszewski ◽  
Alan Blake
Keyword(s):  
Thin Film ◽  
Wafer Level ◽  
Thin Film Encapsulation

Thin-film encapsulation technology for above-IC MEMS wafer-level packaging

2013 ◽  
Vol 23 (12) ◽  
pp. 125012 ◽  
Author(s):  
Qing Zhang ◽  
Paul-Vahé Cicek ◽  
Frederic Nabki ◽  
Mourad El-Gamal
Keyword(s):  
Thin Film ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Thin Film Encapsulation

scholarly journals Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems

Sensors ◽  
2020 ◽  
Vol 20 (7) ◽  
pp. 2133 ◽  
Author(s):  
Anna Persano ◽  
Fabio Quaranta ◽  
Antonietta Taurino ◽  
Pietro Aleardo Siciliano ◽  
Jacopo Iannacci
Keyword(s):  
Thin Film ◽  
Microelectromechanical Systems ◽  
Rf Mems ◽  
Sacrificial Layer ◽  
Three Dimensional ◽  
Telecommunication Systems ◽  
Rf Performance ◽  
Three Dimensional Finite Element ◽  
The Impact ◽  
Thin Film Encapsulation

In this work, SiNx/a-Si/SiNx caps on conductive coplanar waveguides (CPWs) are proposed for thin film encapsulation of radio-frequency microelectromechanical systems (RF MEMS), in view of the application of these devices in fifth generation (5G) and modern telecommunication systems. Simplification and cost reduction of the fabrication process were obtained, using two etching processes in the same barrel chamber to create a matrix of holes through the capping layer and to remove the sacrificial layer under the cap. Encapsulating layers with etch holes of different size and density were fabricated to evaluate the removal of the sacrificial layer as a function of the percentage of the cap perforated area. Barrel etching process parameters also varied. Finally, a full three-dimensional finite element method-based simulation model was developed to predict the impact of fabricated thin film encapsulating caps on RF performance of CPWs.

Wafer-level micropackaging in thin film technology for RF MEMS applications

2017 ◽  
Vol 24 (1) ◽  
pp. 575-585 ◽  
Author(s):  
A. Persano ◽  
P. Siciliano ◽  
F. Quaranta ◽  
A. Taurino ◽  
A. Lucibello ◽  
...  
Keyword(s):  
Thin Film ◽  
Rf Mems ◽  
Wafer Level ◽  
Thin Film Technology

Thin film wafer level encapsulated RF-MEMS switch for D-Band applications

2016 ◽  
Author(s):  
S. Tolunay Wipf ◽  
A. Goritz ◽  
M. Wietstruck ◽  
C. Wipf ◽  
B. Tillack ◽  
...  
Keyword(s):  
Thin Film ◽  
Rf Mems ◽  
Wafer Level ◽  
Rf Mems Switch ◽  
Mems Switch
Sign in / Sign up

Export Citation Format

Share Document