Assembly and Application Specific Methodology to Determine Accelerated Temperature Cycling Requirements for Pb-free Solder Joint Reliability

2007 ◽  
Author(s):  
Ron Zhang
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Free Solder ◽  
Application Specific

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

2011 ◽  
pp. 74-74-15 ◽  
Author(s):  
Weiqiang Wang ◽  
Michael Osterman ◽  
Diganta Das ◽  
Michael Pecht
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

Effects of load and thermal conditions on Pb-free solder joint reliability

2004 ◽  
Vol 33 (12) ◽  
pp. 1507-1515 ◽  
Author(s):  
J. Liang ◽  
S. Downes ◽  
N. Dariavach ◽  
D. Shangguan ◽  
S. M. Heinrich
Keyword(s):  
Solder Joint ◽  
Thermal Conditions ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Free Solder

Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling

2010 ◽  
Vol 7 (8) ◽  
pp. 102939
Author(s):  
Weiqiang Wang ◽  
Michael Osterman ◽  
Diganta Das ◽  
Michael Pecht ◽  
S. W. Dean
Keyword(s):  
Solder Joint ◽  
Temperature Cycling ◽  
Lead Frame ◽  
Solder Joint Reliability ◽  
Joint Reliability

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly Under Mechanical Drop Test

2002 ◽  
Author(s):  
Shi-Wei Ricky Lee ◽  
Yin-Lai Tracy Li ◽  
Hoi-Wai Ben Lui
Keyword(s):  
Solder Joint ◽  
Failure Modes ◽  
Solder Joints ◽  
Drop Test ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Free Solder ◽  
Board Level ◽  
Better Than ◽  
Mechanical Drop Test

The present study is intended to investigate the board level solder joint reliability of PBGA assemblies under mechanical drop test. During the course of this study, a five-leg experiment was designed to investigate various combinations of solder materials and peak reflow temperatures. Two major failure modes, namely, solder cracking and copper trace breakage, were identified. In addition, the critical location of solder joints was characterized. It was found that Sn-Pb eutectic solder joints performed better than Pb-free solder joints under mechanical impact loading.

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