Ultra Thin Hermetic Wafer level, Chip Scale Package

2006 ◽  
Author(s):  
L. Shiv ◽  
M. Heschel ◽  
H. Korth ◽  
S. Weichel ◽  
R. Hauffe ◽  
...  
Keyword(s):  
Wafer Level ◽  
Chip Scale Package

Sample Preparation Challenges In WLCSP Epoxy Underfill Coating Removal

2012 ◽  
Author(s):  
Jason H. Lagar ◽  
Rudolf A. Sia
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Vital Role ◽  
Fault Isolation ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Coating Removal ◽  
Customer Returns ◽  
Preparation Techniques ◽  
Mechanical Defect

Abstract Most Wafer Level Chip Scale Package (WLCSP) units returned by customers for failure analysis are mounted on PCB modules with an epoxy underfill coating. The biggest challenge in failure analysis is the sample preparation to remove the WLCSP device from the PCB without inducing any mechanical defect. This includes the removal of the underfill material to enable further electrical verification and fault isolation analysis. This paper discusses the evaluations conducted in establishing the WLCSP demounting process and removal of the epoxy underfill coating. Combinations of different sample preparation techniques and physical failure analysis steps were evaluated. The established process enabled the electrical verification, fault isolation and further destructive analysis of WLCSP customer returns mounted on PCB and with an epoxy underfill coating material. This paper will also showcase some actual full failure analysis of WLCSP customer returns where the established process played a vital role in finding the failure mechanism.

Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume Manufacturing

2014 ◽  
Vol 2014 (1) ◽  
pp. 000155-000160
Author(s):  
Jin You Zao ◽  
Bong Yin Yen ◽  
Lim Beng Kuan ◽  
John Thornell ◽  
Darcy Hart ◽  
...  
Keyword(s):  
Process Control ◽  
High Volume ◽  
Critical Dimension ◽  
Thickness Measurement ◽  
Electrical Performance ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Under Sampling ◽  
Line Process ◽  
Increasing Demand

Wafer Bumping In-line Process control of Wafer-Level Chip Scale Package (WLCSP) requires accurate measurement of bump features during processing. These bump features include critical dimension of Redistribution Layer (RDL), Under Bump Metal (UBM) and transparent polyimide thickness. For a 4-Mask Layer Cu plated WLCSP, accurate feature thickness measurement is required for both the Redistribution Layer (RDL) and Under Bump Metal (UBM) to ensure consistent delivery of good electrical performance and package reliability. This is especially important as WLCSP is moving towards finer feature size and pitch to meet increasing demand for smaller form factor. This paper reports the development of an automated Critical Dimension (CD) measurement solution capable of measuring features at pre-defined locations on different topology both under sampling and full inspection mode on wafer. The solution is fully scalable to meet the requirement of high product-mix HVM environment, by highly adaptive to different features on different products for which measurement needs to be automated for effective process control.

Creating Semiconductor Value through Advanced Package Technology

2016 ◽  
Vol 2016 (S1) ◽  
pp. S1-S46
Author(s):  
Ron Huemoeller
Keyword(s):  
Big Five ◽  
Flip Chip ◽  
Microelectromechanical Systems ◽  
Technology Innovation ◽  
Low Cost ◽  
Semiconductor Industry ◽  
Significant Shift ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Advanced Packaging

Over the past few years, there has been a significant shift from PCs and notebooks to smartphones and tablets as drivers of advanced packaging innovation. In fact, the overall packaging industry is doing quite well today as a result, with solid growth expected to create a market value in excess of $30B USD by 2020. This is largely due to the technology innovation in the semiconductor industry continuing to march forward at an incredible pace, with silicon advancements in new node technologies continuing on one end of the spectrum and innovative packaging solutions coming forward on the other in a complementary fashion. The pace of innovation has quickened as has the investments required to bring such technologies to production. At the packaging level, the investments required to support the advancements in silicon miniaturization and heterogeneous integration have now reached well beyond $500M USD per year. Why has the investment to support technology innovation in the packaging community grown so much? One needs to look no further than the complexity of the most advanced package technologies being used today and coming into production over the next year. Advanced packaging technologies have increased in complexity over the years, transitioning from single to multi-die packaging, enabled by 3-dimensional integration, system-in-package (SiP), wafer-level packaging (WLP), 2.5D/3D technologies and creative approached to embedding die. These new innovative packaging technologies enable more functionality and offer higher levels of integration within the same package footprint, or even more so, in an intensely reduced footprint. In an industry segment that has grown accustomed to a multitude of package options, technology consolidation seems evident, producing “The Big Five” advanced packaging platforms. These include low-cost flip chip, wafer-level chip-scale package (WLCSP), microelectromechanical systems (MEMS), laminate-based advanced system-in-package (SiP) and wafer-based advanced SiP designs. This presentation will address ‘The Big Five’ packaging platforms and how they are adding value to the Semiconductor Industry.

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

2005 ◽  
Vol 127 (1) ◽  
pp. 7-11 ◽  
Author(s):  
A. Polyakov ◽  
M. Bartek ◽  
J. N. Burghartz
Keyword(s):  
Fracture Toughness ◽  
Tensile Strength ◽  
Wafer Bonding ◽  
Potential Application ◽  
Adhesive Bonding ◽  
Wafer Level ◽  
Chip Scale Package ◽  
Rf Applications

This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5±3.9J/m2 with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications.

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