Development and Characterization of Large Silicon Microchannel Heat Sink Packages for Thermal Management of High Power Microelectronics Modules

2006 ◽  
Author(s):  
Hengyun Zhang ◽  
Qingxin Zhang ◽  
Ser-Choong Chong ◽  
D. Pinjala ◽  
Xiaoping Liu ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Heat Sink ◽  
Microchannel Heat Sink

Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink

2020 ◽  
Vol 172 ◽  
pp. 115165 ◽  
Author(s):  
Xiaohui Lin ◽  
Songping Mo ◽  
Bingzhong Mo ◽  
Lisi Jia ◽  
Ying Chen ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Thermoelectric Cooler ◽  
High Power Led

GaN-on-Si hotspot thermal management using direct-die-attached microchannel heat sink

2012 ◽  
Author(s):  
Yong Jiun Lee ◽  
Boon Long Lau ◽  
Yoke Choy Leong ◽  
Kok Fah Choo ◽  
Xiaowu Zhang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Gan On Si

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots

2010 ◽  
Author(s):  
Vivek Sahu ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Transient Response ◽  
High Power ◽  
Chip Thickness ◽  
Microchannel Heat Sink ◽  
High Power Density ◽  
Dynamic Thermal Management ◽  
Hybrid Cooling ◽  
Lower Background

A hybrid cooling scheme for thermal management of hotspots (300–500 W/cm2) in the presence of low background heat flux (100 W/cm2 over 1 cm2) is being investigated. It uses superlattice coolers (SLCs) to remove ultra high power density hotspot and microchannel heat sink for lower background heat flux. In this paper, transient response of the SLC for hotspot removal is studied. The effect of contact resistance, chip thickness, and hotspot size on the performance of the hybrid cooling scheme is also investigated.

scholarly journals Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions

2018 ◽  
Vol 126 ◽  
pp. 1289-1301 ◽  
Author(s):  
Kevin P. Drummond ◽  
Doosan Back ◽  
Michael D. Sinanis ◽  
David B. Janes ◽  
Dimitrios Peroulis ◽  
...  
Keyword(s):  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Manifold Microchannel
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