GaN-on-Si hotspot thermal management using direct-die-attached microchannel heat sink

2012 ◽  
Author(s):  
Yong Jiun Lee ◽  
Boon Long Lau ◽  
Yoke Choy Leong ◽  
Kok Fah Choo ◽  
Xiaowu Zhang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Gan On Si

scholarly journals Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

2014 ◽  
Vol 4 (9) ◽  
pp. 1441-1450 ◽  
Author(s):  
Yong Han ◽  
Boon Long Lau ◽  
Xiaowu Zhang ◽  
Yoke Choy Leong ◽  
Kok Fah Choo
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Gan On Si

Hot-Spot Thermal Management With Flow Modulation in a Microchannel Heat Sink

2005 ◽  
Author(s):  
Poh-Seng Lee ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Thermal Management ◽  
Heat Sink ◽  
Hot Spot ◽  
Microchannel Heat Sink ◽  
Transfer Enhancement ◽  
Local Enhancement ◽  
Flow Modulation ◽  
Flow And Heat Transfer

Recesses created in the lid of a microchannel heat sink can serve to modulate the flow, resulting in local and global heat transfer enhancement. Numerical analysis of laminar flow and heat transfer in such a modified microchannel heat sink has shown an augmentation of heat transfer without an added penalty of increased pressure drop. The presence of the recesses reduces the overall flow friction and thus pressure drop. The flow expansion into the recesses and the subsequent contraction into the downstream region causes significant local enhancement in heat transfer. Both the maximum and average wall temperatures are decreased as a result. The heat transfer is locally enhanced, by as much as 150% in the regions just downstream of the recesses due to the re-initialization of boundary layers as the flow re-enters the microchannels. The potential for hot-spot mitigation in microelectronics devices using this approach is discussed.

Numerical Simulation of Flow Boiling in Micro Channel to Study Bubble Dynamics

2019 ◽  
Author(s):  
Uday Kumar Alugoju ◽  
Satish Kumar Dubey ◽  
Arshad Javed
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Bubble Dynamics ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
Clear Understanding ◽  
Microchannel Heat Sink ◽  
Micro Channel ◽  
The Impact

Abstract With the recent developments in miniaturization techniques of electronic chips, the power density of these chips has risen drastically. Available thermal management technologies like air cooled heat sink and liquid cooled heat sink are unable to keep up with the demand. However, thermal management technologies using flow boiling in microchannel heat sink can dissipate higher heat fluxes. Flow boiling technologies in micro channel heat sinks are not commercially established due to issues such as reliability, flow reversal, dry out, critical heat flux, limited knowledge of bubble dynamics, correlations, etc. In this study, performance of flow boiling in a diverging microchannel with uniform heat flux condition has been investigated. Simulations have been performed on ANSYS Fluent using Volume of Fluid (VOF). VOF is used to track the interface between different phases. The impact of angle on the bubble dynamics of the coolant and flow patterns has been studied. The simulated numerical results are compiled and presented. The results provide a clear understanding of the impact of angle on the bubble dynamics in flow boiling microchannel heat sink.

Thermal management of high-power LED based on thermoelectric cooler and nanofluid-cooled microchannel heat sink

2020 ◽  
Vol 172 ◽  
pp. 115165 ◽  
Author(s):  
Xiaohui Lin ◽  
Songping Mo ◽  
Bingzhong Mo ◽  
Lisi Jia ◽  
Ying Chen ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Thermoelectric Cooler ◽  
High Power Led

Microchannel Heat Sink for Thermal Management of Concentrated Photovoltaic Cells

2021 ◽  
Author(s):  
Dinumol Varghese ◽  
Ahmed Sefelnasr ◽  
Mohsen Sherif ◽  
Fadi Alnaimat ◽  
Bobby Mathew
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Management ◽  
Heat Sink ◽  
Stokes Equations ◽  
Photovoltaic Cells ◽  
Navier Stokes ◽  
Microchannel Heat Sink ◽  
Pumping Power ◽  
Energy Equations

Abstract This article conceptualizes a single-phase microchannel heat sink for thermal management of concentrated photovoltaic cells; details of the model-based parametric study that is carried out on the heat sink is also detailed in this article. The heat sink consists of multiple serpentine microchannels. The mathematical model consists of continuity equation, Navier-Stokes equations and energy equations. Fluent module of Ansys Workbench is used for solving the model. The performance of the device is quantified in terms two metrics such as thermal resistance and pumping power. Studies are done for Reynolds number ranging from 100 to 1250. It is observed that increase in Reynolds number decreases the thermal resistance while increasing the pumping power irrespective of the geometric parameters of the heat sink. Decrease in hydraulic diameter of the microchannel reduces the thermal resistance while increasing the pumping power. Increase in the length segment of the serpentine microchannel increases and decreases the thermal resistance and pumping power, respectively. With increase in the offset width of the serpentine microchannel the thermal resistance and pumping power decreases and increases, respectively.

scholarly journals Enhancement of Hotspot Cooling With Diamond Heat Spreader on Cu Microchannel Heat Sink for GaN-on-Si Device

2014 ◽  
Vol 4 (6) ◽  
pp. 983-990 ◽  
Author(s):  
Yong Han ◽  
Boon Long Lau ◽  
Xiaowu Zhang ◽  
Yoke Choy Leong ◽  
Kok Fah Choo
Keyword(s):  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Heat Spreader ◽  
Gan On Si
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