3D nonlinear thermal stress analysis of VCSEL (vertical-cavity surface-emitting laser) assemblies with lead-free flip-chip interconnects

Author(s):  
Yida Zou ◽  
J. Lau ◽  
S. Catnerlo
Author(s):  
Yoshitaka Ohiso ◽  
Kouta Tateno ◽  
Yoshitaka Kohama ◽  
Hideki Tsunetsugu ◽  
Takashi Kurokawa

2003 ◽  
Vol 76 (5) ◽  
pp. 603-608 ◽  
Author(s):  
G. Totschnig ◽  
M. Lackner ◽  
R. Shau ◽  
M. Ortsiefer ◽  
J. Rosskopf ◽  
...  

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