Joule Heating Effect under Accelerated Electromigration in Flip-Chip Solder Joints

Author(s):  
S.H. Chiu ◽  
S.W. Liang ◽  
Chih Chen ◽  
D.J. Yao ◽  
Y.C. Liu ◽  
...  
2010 ◽  
Vol 1249 ◽  
Author(s):  
Hsiang Yao Hsiao ◽  
Chih Chen ◽  
D. J. Yao

AbstractThe Joule heating effect at various stages under electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 A at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints increased with the bump resistance and the increase of current stressing time. It increased very slowly in initial stages. In the last stage, the temperature of the solder bump increased rapidly due to the increase of the bump resistance and the local Joule heating effect.


2017 ◽  
Vol 101 ◽  
pp. 96-105 ◽  
Author(s):  
Hyun-Woo Jung ◽  
Seung-Jae Kim ◽  
Yun-Jae Kim ◽  
Jung-Yup Kim ◽  
Joo-Yul Lee ◽  
...  

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
C. Ahamed Saleel ◽  
Saad Ayed Alshahrani ◽  
Asif Afzal ◽  
Maughal Ahmed Ali Baig ◽  
Sarfaraz Kamangar ◽  
...  

PurposeJoule heating effect is a pervasive phenomenon in electro-osmotic flow because of the applied electric field and fluid electrical resistivity across the microchannels. Its effect in electro-osmotic flow field is an important mechanism to control the flow inside the microchannels and it includes numerous applications.Design/methodology/approachThis research article details the numerical investigation on alterations in the profile of stream wise velocity of simple Couette-electroosmotic flow and pressure driven electro-osmotic Couette flow by the dynamic viscosity variations happened due to the Joule heating effect throughout the dielectric fluid usually observed in various microfluidic devices.FindingsThe advantages of the Joule heating effect are not only to control the velocity in microchannels but also to act as an active method to enhance the mixing efficiency. The results of numerical investigations reveal that the thermal field due to Joule heating effect causes considerable variation of dynamic viscosity across the microchannel to initiate a shear flow when EDL (Electrical Double Layer) thickness is increased and is being varied across the channel.Originality/valueThis research work suggest how joule heating can be used as en effective mechanism for flow control in microfluidic devices.


2016 ◽  
Vol 78 (8-4) ◽  
Author(s):  
Ummikalsom Abidin ◽  
Jumril Yunas ◽  
Burhanuddin Yeop Majlis

Joule heating effect is substantial in an electromagnet system due to high density current from current-carrying conductor for high magnetic field generation. In Lab-on-chip (LoC) Magnetically Activated Cell Sorting (MACS) device, Joule heating effect generating high temperature and affecting the biological cells viability is investigated. The temperature rise of the integrated system was measured using resistance temperature detector, RTD Pt100. Three temperature rise conditions which are from the bare spiral-shaped magnet wire, the combination of magnet wire and on-chip magnetic core and combination of magnet wire, on-chip magnetic core and 150 mm polydimethylsiloxane (PDMS) layer have been investigated.  The combination of electromagnet of spiral-shaped magnet wire coil and on-chip magnetic core has reduced the temperature significantly which are, ~ 38 %  and ~ 26 % with magnet wire winding, N = 10 (IDC = 3.0 A, t = 210 s) and N = 20 (IDC = 2.5 A, t = 210 s) respectively. The reduced Joule heating effect is expected due to silicon chip of high thermal conductivity material enable fast heat dissipation to the surrounding.  Therefore, the integration of electromagnet system and on-chip magnetic core has the potential to be used as part of LoC MACS system provided the optimum operating conditions are determined


Sign in / Sign up

Export Citation Format

Share Document