Design & Development of a Large Die and Fine Pitch Wafer-Level Package for Mobile Applications

2006 ◽  
Author(s):  
V. Kripesh ◽  
Xiaowu Zhang ◽  
N. Khan ◽  
M. Rotaru ◽  
Chai Tai Chong
Keyword(s):  
Mobile Applications ◽  
Design Development ◽  
Wafer Level ◽  
Fine Pitch ◽  
Wafer Level Package

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

2008 ◽  
Vol 48 (4) ◽  
pp. 602-610 ◽  
Author(s):  
Xiaowu Zhang ◽  
Vaidyanathan Kripesh ◽  
T.C. Chai ◽  
Teck Chun Tan ◽  
D. Pinjala
Keyword(s):  
Solder Joint ◽  
Reliability Analysis ◽  
Wafer Level ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Fine Pitch ◽  
Board Level ◽  
Wafer Level Package

Design and Development of Fine Pitch Copper/Low-K Wafer Level Package

2010 ◽  
Vol 33 (2) ◽  
pp. 377-388 ◽  
Author(s):  
Vempati Srinivasa Rao ◽  
Xiaowu Zhang ◽  
Ho Soon Wee ◽  
Ranjan Rajoo ◽  
C S Premachandran ◽  
...  
Keyword(s):  
Wafer Level ◽  
Design And Development ◽  
Fine Pitch ◽  
Wafer Level Package ◽  
Low K
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