Drop Impact: Fundamentals and Impact Characterisation of Solder Joints

2005 ◽  
Author(s):  
E.H. Wong ◽  
R. Rajoo ◽  
Y.W. Mai ◽  
S.K.W. Seah ◽  
K.T. Tsai ◽  
...  
Keyword(s):  
Solder Joints ◽  
Drop Impact

Examination of the impact test equipment used for the assessment of drop impact reliability for the solder joints

2002 ◽  
Vol 2002 (0) ◽  
pp. 239-240
Author(s):  
Qiang YU ◽  
Hironobu KIKUCHI ◽  
Keiji WATANABE ◽  
Manabu KAKINO ◽  
Noriyuki FUJIWARA ◽  
...  
Keyword(s):  
Impact Test ◽  
Solder Joints ◽  
Drop Impact ◽  
Test Equipment ◽  
Impact Reliability ◽  
The Impact

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
Tong An ◽  
Fei Qin
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Impact Loading ◽  
Driving Force ◽  
Solder Joints ◽  
Compound Layer ◽  
Drop Impact ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Crack Driving Force

The significant difference between failure modes of lead-containing and lead-free solder joints under drop impact loading remains to be not well understood. In this paper, we propose a feasible finite element approach to model the cracking behavior of solder joints under drop impact loading. In the approach, the intermetallic compound layer/solder bulk interface is modeled by the cohesive zone model, and the crack driving force in the intermetallic compound layer is evaluated by computing the energy release rate. The numerical simulation of a board level package under drop impact loading shows that, for the lead-containing Sn37Pb solder joint, the damage in the vicinity of the intermetallic compound layer initiates earlier and is much greater than that in the lead-free Sn3.5Ag solder joint. This damage relieves the stress in the intermetallic compound layer and reduces the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing.

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

2009 ◽  
Vol 77 (1) ◽  
Author(s):  
Fei Qin ◽  
Tong An ◽  
Na Chen
Keyword(s):  
Strain Rate ◽  
Impact Analysis ◽  
Solder Joints ◽  
High Strain ◽  
Drop Impact ◽  
Lead Free ◽  
Strain Rates ◽  
High Strain Rates ◽  
Rate Dependent ◽  
Lead Free Solders

As traditional lead-based solders are banned and replaced by lead-free solders, the drop impact reliability is becoming increasingly crucial because there is little understanding of mechanical behaviors of these lead-free solders at high strain rates. In this paper, mechanical properties of one lead-based solder, Sn37Pb, and two lead-free solders, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated at strain rates that ranged from 600 s−1 to 2200 s−1 by the split Hopkinson pressure and tensile bar technique. At high strain rates, tensile strengths of lead-free solders are about 1.5 times greater than that of the Sn37Pb solder, and also their ductility are significantly greater than that of the Sn37Pb. Based on the experimental data, strain rate dependent Johnson–Cook models for the three solders were derived and employed to predict behaviors of solder joints in a board level electronic package subjected to standard drop impact load. Results indicate that for the drop impact analysis of lead-free solder joints, the strain rate effect must be considered and rate-dependent material models of lead-free solders are indispensable.

Assessment of Drop Impact Reliability for BGA Solder Joints : Development of the Dropping Test Method

2004 ◽  
Vol 2004.40 (0) ◽  
pp. 23-24
Author(s):  
Qiang YU ◽  
Keiji WATANABE ◽  
Toshihiro TSURUSAWA ◽  
Masaki SHIRATORI ◽  
Manabu KAKINO ◽  
...  
Keyword(s):  
Solder Joints ◽  
Drop Impact ◽  
Test Method ◽  
Impact Reliability
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