Reliability issues of Pb-free solder joints in electronic packaging technology

2003 ◽  
Author(s):  
K.N. Tu ◽  
K. Zeng
Keyword(s):  
Electronic Packaging ◽  
Solder Joints ◽  
Packaging Technology ◽  
Free Solder

Electromigration in Pb-Free Solder Joints in Electronic Packaging

2012 ◽  
pp. 375-399
Author(s):  
Chih Chen ◽  
Shih-Wei Liang ◽  
Yuan-Wei Chang ◽  
Hsiang-Yao Hsiao ◽  
Jung Kyu Han ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Solder Joints ◽  
Free Solder

Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging

2012 ◽  
Vol 59 (12) ◽  
pp. 3269-3272 ◽  
Author(s):  
Liang Zhang ◽  
Ji-Guang Han ◽  
Yong-Huan Guo ◽  
Cheng-Wen He
Keyword(s):  
Electronic Packaging ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder
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