Lead-Free Solders: Materials Reliability for Electronics
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Published By John Wiley & Sons, Ltd

9781119966203, 9780470971826
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Phase Diagrams and Their Applications in Pb-Free Soldering

2012 ◽  
pp. 11-44
Author(s):  
Sinn-Wen Chen ◽  
Wojciech Gierlotka ◽  
Hsin-Jay Wu ◽  
Shih-Kang Lin
Keyword(s):  
Phase Diagrams

Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

2012 ◽  
pp. 423-442
Author(s):  
Tian Tian ◽  
K. N. Tu ◽  
Hsiao-Yun Chen ◽  
Hsiang-Yao Hsiao ◽  
Chih Chen
Keyword(s):  
Flip Chip ◽  
Solder Joints

Effects of Electromigration on Electronic Solder Joints

2012 ◽  
pp. 401-422 ◽  
Author(s):  
Sinn-Wen Chen ◽  
Chih-Ming Chen ◽  
Chao-Hong Wang ◽  
Chia-Ming Hsu
Keyword(s):  
Solder Joints

Electromigration in Pb-Free Solder Joints in Electronic Packaging

2012 ◽  
pp. 375-399
Author(s):  
Chih Chen ◽  
Shih-Wei Liang ◽  
Yuan-Wei Chang ◽  
Hsiang-Yao Hsiao ◽  
Jung Kyu Han ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Solder Joints ◽  
Free Solder

Phase Diagrams and Alloy Development

2012 ◽  
pp. 45-70 ◽  
Author(s):  
Alan Dinsdale ◽  
Andy Watson ◽  
Ales Kroupa ◽  
Jan Vrestal ◽  
Adela Zemanova ◽  
...  
Keyword(s):  
Phase Diagrams ◽  
Alloy Development
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