Distance learning in thermal design of electronic systems - the IEEE/NSF project

2002 ◽  
Author(s):  
Y. Joshi ◽  
J.K. Sircar ◽  
A. Bar-Cohen ◽  
S. Bhavnani ◽  
J. Barnes
Keyword(s):  
Distance Learning ◽  
Thermal Design ◽  
Electronic Systems

scholarly journals Experimental and numerical investigation of heat dissipation from an electronic component in a closed enclosure

2018 ◽  
Vol 144 ◽  
pp. 04010
Author(s):  
Bobin Saji George ◽  
M. Ajmal ◽  
S. R. Deepu ◽  
M. Aswin ◽  
D. Ribin ◽  
...  
Keyword(s):  
Power Dissipation ◽  
Heat Dissipation ◽  
Numerical Study ◽  
Electronic Component ◽  
Thermal Design ◽  
Electronic Systems ◽  
Computational Domain ◽  
Computational Tool ◽  
Cycle Times ◽  
Design Cycle

Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal design tools that enable accurate solutions to be generated and quickly assessed. The present numerical study aims at developing a computational tool in OpenFOAM that can predict the heat dissipation rate and temperature profile of any electronic component in operation. A suitable computational domain with defined aspect ratio is chosen. For analyzing, “buoyant Boussinesq Simple Foam“ solver available with OpenFOAM is used. It was modified for adapting to the investigation with specified initial and boundary conditions. The experimental setup was made with the dimensions taken up for numerical study. Thermocouples were calibrated and placed in specified locations. For different heat input, the temperatures are noted down at steady state and compared with results from the numerical study.

scholarly journals Thermal Phenomena in Nanoscale Transistors

2006 ◽  
Vol 128 (2) ◽  
pp. 102-108 ◽  
Author(s):  
Eric Pop ◽  
Kenneth E. Goodson
Keyword(s):  
Diffusion Theory ◽  
Hot Spot ◽  
Volume Ratio ◽  
Phonon Transport ◽  
Thermal Design ◽  
Electronic Systems ◽  
Ballistic Electron ◽  
Ballistic Electron Transport ◽  
Cmos Transistor ◽  
Thermal Phenomena

As CMOS transistor gate lengths are scaled below 45nm, thermal device design is becoming an important part of microprocessor engineering. Decreasing dimensions lead to nanometer-scale hot spots in the drain region of the device, which may increase the drain series and source injection electrical resistances. Such trends are accelerated with the introduction of novel materials and nontraditional transistor geometries, like ultrathin body, surround-gate, or nanowire devices, which impede heat conduction. Thermal analysis is complicated by subcontinuum phenomenan including ballistic electron transport, which reshapes the hot spot region compared with classical diffusion theory predictions. Ballistic phonon transport from the hot spot and between material boundaries impedes conduction cooling. The increased surface to volume ratio of novel transistor designs also leads to a larger contribution from material boundary thermal resistance. In this paper we survey trends in transistor geometries and materials, from bulk silicon to carbon nanotubes, along with their implications for the thermal design of electronic systems.

Teaching Capstone Thermal Systems Design Using ANSYS ICEPAK Based Projects

2019 ◽  
Author(s):  
Kevin R. Anderson
Keyword(s):  
Mechanical Engineering ◽  
Systems Design ◽  
Thermal Design ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Thermal Systems ◽  
Private Industry ◽  
Senior Design ◽  
Student Teams ◽  
Learn By Doing

Abstract This paper describes the use of ANSYS ICEPAK software in teaching a senior level capstone thermal systems design course in a Mechanical Engineering curriculum. The use of ANSYS ICEPAK software tools in the thermal design course allows our undergraduates the preparation they need to become competitive and productive in today’s private industry sector. The paradigm of learn-by-doing adopted by the college is used in the thermal design course by exposing students to the use of ANSYS ICEPAK software in order to complete a design project in the thermal design course. The senior level capstone thermal design course is a three-unit semester course. Students are broken into teams and are tasked to solve a variety of thermal-fluid, heat transfer related design problem scenarios. The student teams are tasked to design an electronic systems thermal management system using PCBS, fans, heat sinks, heat pipes, etc. in order to meet a set of pre-defined requirements. In this manner, the use of the ICEPAK projects serves to build the soft skills (report writing and technical presentation) of the students. This paper will include examples of ANSYS ICEPAK based thermal design projects and methods of assessment and illustrations of how the thermal design course addresses the Mechanical Engineering program’s ABET objectives and outcomes related to senior design capstone design courses.

Thermal Design for Probe Transformation of Phase Change Vias

2008 ◽  
Author(s):  
Hsinyi Lo ◽  
James A. Bain
Keyword(s):  
Thermal Cycling ◽  
Phase Change ◽  
Electrical Resistance ◽  
Single Phase ◽  
Thermal Design ◽  
Electronic Systems ◽  
Afm Tips ◽  
Signal Switching ◽  
Chalcogenide Materials ◽  
Heat Sinking

Thermal cycling of chalcogenide materials (Ge2Sb2Te5 or GeSb for example) causes switching between two electrical resistance levels in the materials. This is the basis of PC memory, and offers the possibility of use for programmable signal switching in electronic systems as well. Here we propose a design for connection topology, using dual tip AFM-type probes. The design subdivides a single phase change via into a parallel array of three-terminal sub-vias which are well-suited to addressing with probes. This sub-division reduces required power and current to acceptable levels. Experimental inputs to the model were extracted from two sources. First, current levels were limited to levels that have previously been shown possible to deliver with AFM tips. Secondly, measurements of PC resistance as a function of cooling time were used to determine required heat sinking of the sub-via structures.

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

2000 ◽  
Vol 123 (2) ◽  
pp. 120-126 ◽  
Author(s):  
Reena Cole ◽  
Tara Dalton ◽  
Jeff Punch ◽  
Mark R. Davies ◽  
Ronan Grimes
Keyword(s):  
Design Methodology ◽  
Influence Factors ◽  
Reynolds Numbers ◽  
Thermal Design ◽  
Junction Temperature ◽  
Electronic Systems ◽  
Design Rules ◽  
Passive Components ◽  
Continued Use ◽  
Board Level

The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically determined influence factors to account for thermal and aerodynamic interactions at board level. The paper presents measured values of influence factors for arrays of Plastic Quad Flat Packs (PQFPs) over a range of Reynolds numbers and with a series of board level obstacles modeling upstream passive components. The results are formulated into a novel set of design rules.

Thermal Management of a Fast UV Slitless Spectrometer for a Meteor Research Experiment

2005 ◽  
Author(s):  
E. V. McAssey ◽  
Vahid Vahadat ◽  
Greg LeMunyan ◽  
George Renda
Keyword(s):  
Thermal Management ◽  
Space Shuttle ◽  
Space Station ◽  
Ultra Violet ◽  
Technical Conference ◽  
Ultraviolet Spectrum ◽  
Thermal Design ◽  
Electronic Systems ◽  
Scientific Experiment ◽  
Research Experiment

This paper presents the proposed thermal management design for an ultra-violet slitless spectrometer to be flown on either the Space Shuttle or on the International Space Station as a scientific experiment to capture the ultraviolet spectrum of meteors as they are heated by the Earth’s atmosphere. The proposed telescope was initially planned as a Hitchhiker experiment for the Space Shuttle. The Space Station environment is thermally more critical than the Hitchhiker application. The final thermal design is essentially passive; however, heaters will be used to maintain the component temperatures at acceptable levels during telescope nonoperating conditions. The major difference between the Space Station design and the Hitchhiker design is the use of external multi-layer insulation and thermal strapping on the former application.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

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