Thermal Management of a Fast UV Slitless Spectrometer for a Meteor Research Experiment

2005 ◽  
Author(s):  
E. V. McAssey ◽  
Vahid Vahadat ◽  
Greg LeMunyan ◽  
George Renda

This paper presents the proposed thermal management design for an ultra-violet slitless spectrometer to be flown on either the Space Shuttle or on the International Space Station as a scientific experiment to capture the ultraviolet spectrum of meteors as they are heated by the Earth’s atmosphere. The proposed telescope was initially planned as a Hitchhiker experiment for the Space Shuttle. The Space Station environment is thermally more critical than the Hitchhiker application. The final thermal design is essentially passive; however, heaters will be used to maintain the component temperatures at acceptable levels during telescope nonoperating conditions. The major difference between the Space Station design and the Hitchhiker design is the use of external multi-layer insulation and thermal strapping on the former application.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

2005 ◽  
Author(s):  
Andrew C. Miner ◽  
Uttam Ghoshal

The illumination of a sample when imaged by thermoreflectance thermal microscopy may cause significant heating of the surface. Nonlinearities in the performance of the system being imaged may lead to large measurement induced errors in the observed temperature field. Analytical expressions are presented to estimate the temperature rise and heat flux in a sample. Spatially filtered thermo-reflectance microscopy is introduced as a technique to significantly reduce the incident heat flux without loss of spatial resolution.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.


2018 ◽  
Vol 144 ◽  
pp. 04010
Author(s):  
Bobin Saji George ◽  
M. Ajmal ◽  
S. R. Deepu ◽  
M. Aswin ◽  
D. Ribin ◽  
...  

Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal design tools that enable accurate solutions to be generated and quickly assessed. The present numerical study aims at developing a computational tool in OpenFOAM that can predict the heat dissipation rate and temperature profile of any electronic component in operation. A suitable computational domain with defined aspect ratio is chosen. For analyzing, “buoyant Boussinesq Simple Foam“ solver available with OpenFOAM is used. It was modified for adapting to the investigation with specified initial and boundary conditions. The experimental setup was made with the dimensions taken up for numerical study. Thermocouples were calibrated and placed in specified locations. For different heat input, the temperatures are noted down at steady state and compared with results from the numerical study.


1980 ◽  
Vol 7 (4-5) ◽  
pp. 699-717
Author(s):  
T. Svoboda ◽  
T. Svítek ◽  
J. Vackář ◽  
M. Kirschner ◽  
J. Bárta ◽  
...  
Keyword(s):  

1991 ◽  
Vol 113 (1) ◽  
pp. 42-50 ◽  
Author(s):  
Kurt O. Lund ◽  
Anthony M. Colangelo ◽  
Gregory S. McKim

A thermal design for a solar pointing Space Shuttle mission is presented. The apparatus, which will measure solar flux intensity variations, contains sensors and data acquisition electronics which must be maintained within certain temperature constraints. The thermal design, which utilizes parallel heat flow paths and conduction fins to reject dissipated heat, is shown by finite difference thermal modeling to maintain component temperatures within these constraints. In the thermal modeling, arithmetic nodes are used to represent surface radiosity for radiation heat transfer. Also, the concept of mean fin conduction length and effective fin capacitance are introduced as means of simplifying the model representation of the conduction fins. An experiment was conducted to evaluate the chip/fin contact conductance.


Author(s):  
Valerie Neal

Chapter 5, “Space Station: Campaigning for a Permanent Human Presence in Space,” transitions from the space shuttle as the focus of U.S. human spaceflight to NASA’s push for a permanent space station from the 1980s into the new century. The space station became the new icon for justifying humans living and working off the planet. The focus here is the constant effort to shape and reshape both the rationale for the station and its actual configuration in the face of mounting opposition. Two phrases served to reshape the meaning of spaceflight once a space station claimed the agenda: “the next logical step” and “a permanent presence in space.”


2017 ◽  
Vol 122 (7) ◽  
pp. 7670-7682
Author(s):  
Yuta Hozumi ◽  
Akinori Saito ◽  
Ichiro Yoshikawa ◽  
Atsushi Yamazaki ◽  
Go Murakami ◽  
...  

2011 ◽  
Vol 133 (07) ◽  
pp. 46-53
Author(s):  
Burton Dicht

This article analyzes the decisions and technological challenges that drove the Space Shuttle’s development. The goal of the Shuttle program was to create a reusable vehicle that could reduce the cost of delivering humans and large payloads into space. Although the Shuttle was a remarkable flying machine, it never lived up to the goals of an airline-style operation with low operating costs. In January 2004, a year after the Columbia accident, President George W. Bush unveiled the “Vision for U.S. Space Exploration” to guide the U.S. space effort for the next two decades. A major component of the new vision, driven by the recommendations of the Columbia Accident Investigation Board, was to retire the Space Shuttle fleet as soon as the International Space Station assembly was completed. With cancellation of the Constellation program in 2010, the planned successor to the Shuttle, the U.S. space program is now in an era of uncertainty.


Author(s):  
Kailyn Cage ◽  
Monifa Vaughn-Cooke ◽  
Mark Fuge ◽  
Briana Lucero ◽  
Dusan Spernjak ◽  
...  

Additive manufacturing (AM) processes allow for complex geometries to be developed in a cost- and time-efficient manner in small-scale productions. The unique functionality of AM offers an ideal collaboration between specific applications of human variability and thermal management. This research investigates the intersection of AM, human variability and thermal management in the development of a military helmet heat exchanger. A primary aim of this research was to establish the effectiveness of AM components in thermal applications based on material composition. Using additively manufactured heat pipe holders, the thermal properties of a passive evaporative cooler are tested for performance capability with various heat pipes over two environmental conditions. This study conducted a proof-of-concept design for a passive helmet heat exchanger, incorporating AM components as both the heat pipe holders and the cushioning material targeting internal head temperatures of ≤ 35°C. Copper heat pipes from 3 manufactures with three lengths were analytically simulated and experimentally tested for their effectiveness in the helmet design. A total of 12 heat pipes were tested with 2 heat pipes per holder in a lateral configuration inside a thermal environmental chamber. Two 25-hour tests in an environmental chamber were conducted evaluating temperature (25°C, 45°C) and relative humidity (25%, 50%) for the six types of heat pipes and compared against the analytical models of the helmet heat exchangers. Many of the heat pipes tested were good conduits for moving the heat from the head to the evaporative wicking material. All heat pipes had Coefficients of Performance under 3.5 when tested with the lateral system. Comparisons of the analytical and experimental models show the need for the design to incorporate a re-wetting reservoir. This work on a 2-dimensional system establishes the basis for design improvements and integration of the heat pipes and additively manufactured parts with a 3-dimensional helmet.


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