Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling

2002 ◽  
Author(s):  
Y. Polsky ◽  
C. Ume ◽  
W. Sutherlin
Keyword(s):  
Temperature Cycling ◽  
Printed Wiring Board ◽  
Simply Supported ◽  
Lamination Theory ◽  
Wiring Board

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

2000 ◽  
Vol 123 (1) ◽  
pp. 1-5 ◽  
Author(s):  
Yarom Polsky ◽  
I. Charles Ume
Keyword(s):  
Plane Strain ◽  
Plate Theory ◽  
Shear Deformation Theory ◽  
Transverse Load ◽  
Transverse Shear Strain ◽  
Printed Wiring Board ◽  
Simply Supported ◽  
First Order ◽  
Support Conditions ◽  
Wiring Board

The influence of transverse shear strain in the lamination theory modeling of Printed Wiring Board (PWB) deflection due to support conditions was examined. The in-plane mechanical properties of the core materials of a commercial PWB were measured as a function of temperature. Classical laminated plate theory and first-order shear deformation theory solutions for the out-of-plane deflection of a bare board configuration with two opposite edges simply supported and the remaining edges free were obtained. The weight of the board was approximated as a distributed transverse load. The effect of material property decrease with temperature and FR-4 layer thickness were examined to compare first-order shear and plane strain assumptions for the predicted warpage.

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

1999 ◽  
Vol 121 (4) ◽  
pp. 263-270 ◽  
Author(s):  
Y. Polsky ◽  
I. C. Ume
Keyword(s):  
Experimental Validation ◽  
Effective Properties ◽  
Experimental System ◽  
Thermal Gradients ◽  
Printed Wiring Board ◽  
Reflow Process ◽  
Reflow Soldering ◽  
Lamination Theory ◽  
Support Conditions ◽  
Wiring Board

A bare, four copper layer printed wiring board with simple trace patterns was built for modeling and experimental validation purposes. In-plane elastic properties of the core materials in the board were measured as a function of temperature. Thermoelastic lamination theory was utilized to predict the warpage of the board when subjected to an infrared reflow process, with emphasis on studying the influence of thermal gradients through the board, its support conditions and CTE differential on the warpage process. Board layers with traces were approximated with quasi-homogeneous effective properties obtained using micromechanics theory. An experimental system that employs the shadow moird technique in a simulated infrared reflow environment was used to evaluate the warpage for comparison to modeled results.

Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board

2000 ◽  
Author(s):  
Xiaoling He ◽  
Robert Fulton
Keyword(s):  
Dynamic Analysis ◽  
Modal Analysis ◽  
Temperature Variation ◽  
Equations Of Motion ◽  
Mechanical Analysis ◽  
Response Analysis ◽  
Printed Wiring Board ◽  
Simply Supported ◽  
Laminate Theory ◽  
Wiring Board

Abstract Nonlinear laminate theory is applied and extended for the printed wiring board dynamic analysis. Equations of motion for the isotropic laminates are derived for vibration response analysis of the simply supported printed wiring board under mechanical and thermal loads. Temperature variation in spatial domain is taken into consideration. The effect of the temperature variation on the response character is analyzed and demonstrated by means of numerical results. Modal analysis is made to predict the vibration behavior in terms of deflection and stresses. Lamina stresses are used for failure prediction.

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

Drilled hole damage of small diameter drilling in printed wiring board

2001 ◽  
Vol 118 (1-3) ◽  
pp. 436-441 ◽  
Author(s):  
Eiichi Aoyama ◽  
Hiromich Nobe ◽  
Toshiki Hirogaki
Keyword(s):  
Small Diameter ◽  
Printed Wiring Board ◽  
Wiring Board
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