A thermally enhanced plastic package with indented leadframe

2002 ◽  
Author(s):  
C.C. Lee ◽  
D.H. Chien
Keyword(s):  
Plastic Package

Gallium Arsenide Integrated Circuits Decapsulation Technique Using Mixed Acid Chemistry For Die-Level Failure Analysis

2018 ◽  
Author(s):  
Harold Jeffrey M. Consigo ◽  
Ricardo S. Calanog ◽  
Melissa O. Caseria
Keyword(s):  
Gallium Arsenide ◽  
Sulfuric Acid ◽  
Nitric Acid ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Mixed Acid ◽  
Optimum Parameters ◽  
Plastic Package ◽  
Fuming Nitric Acid ◽  
Concentrated Sulfuric Acid

Abstract Gallium Arsenide (GaAs) integrated circuits have become popular these days with superior speed/power products that permit the development of systems that otherwise would have made it impossible or impractical to construct using silicon semiconductors. However, failure analysis remains to be very challenging as GaAs material is easily dissolved when it is reacted with fuming nitric acid used during standard decapsulation process. By utilizing enhanced chemical decapsulation technique with mixture of fuming nitric acid and concentrated sulfuric acid at a low temperature backed with statistical analysis, successful plastic package decapsulation happens to be reproducible mainly for die level failure analysis purposes. The paper aims to develop a chemical decapsulation process with optimum parameters needed to successfully decapsulate plastic molded GaAs integrated circuits for die level failure analysis.

Failure Analysis of Autoclave-Stressed SRAMs with Aluminum Fuses

1999 ◽  
Author(s):  
Jamey Moss ◽  
Sam Subramanian ◽  
Vince Soorholtz ◽  
Michael Thomas ◽  
Mark Gerber ◽  
...  
Keyword(s):  
Nitric Acid ◽  
Fire Retardant ◽  
Antimony Trioxide ◽  
Back Side ◽  
New Approach ◽  
Eds Analysis ◽  
Plastic Package ◽  
Residual Aluminum ◽  
Rich Material ◽  
Static Ram

Abstract Several hundred units were subjected to autoclave stress as part of the qualification of a new fast static RAM. Many units failed after autoclave stress, and these parts recovered after conventional depotting using nitric acid and a hot plate. Based on the recovery of the units, the failures were determined to be fuse-related because the nitric acid cleared the fuse cavities during depotting. Chemical analysis after thermally extracting the die from the package revealed an antimony-rich material in failing fuse cavities. Source of the antimony was linked to antimony trioxide added to the plastic package as a fire retardant. However, it was unclear whether the antimony-rich material caused the failure or if it was an artifact of thermal depotting. A new approach that did not thermally or chemically alter the fuse cavities was employed to identify the failing fuses. This approach used a combination of back-side grinding, dimpling, and back-side microprobing. The antimony-rich material found in the fuse cavity was confirmed using SEM and TEM-based EDS analysis, and it is believed to be a major contributing factor to fuse failures. However, it is unclear whether the short was caused by the antimony-rich material or by a reaction between that material and residual aluminum (oxide) left in the fuse cavity after the laser blows.

scholarly journals Simulation of Thermal and Electric Field Distribution in Packaged Sausages Heated in a Stationary Versus a Rotating Microwave Oven

Foods ◽  
2021 ◽  
Vol 10 (7) ◽  
pp. 1622
Author(s):  
Wipawee Tepnatim ◽  
Witchuda Daud ◽  
Pitiya Kamonpatana
Keyword(s):  
Temperature Distribution ◽  
Electric Field ◽  
Three Dimensional ◽  
Development Stage ◽  
Microwave Oven ◽  
Computational Time ◽  
Plastic Package ◽  
Heating Uniformity ◽  
The Cost ◽  
Good Agreement

The microwave oven has become a standard appliance to reheat or cook meals in households and convenience stores. However, the main problem of microwave heating is the non-uniform temperature distribution, which may affect food quality and health safety. A three-dimensional mathematical model was developed to simulate the temperature distribution of four ready-to-eat sausages in a plastic package in a stationary versus a rotating microwave oven, and the model was validated experimentally. COMSOL software was applied to predict sausage temperatures at different orientations for the stationary microwave model, whereas COMSOL and COMSOL in combination with MATLAB software were used for a rotating microwave model. A sausage orientation at 135° with the waveguide was similar to that using the rotating microwave model regarding uniform thermal and electric field distributions. Both rotating models provided good agreement between the predicted and actual values and had greater precision than the stationary model. In addition, the computational time using COMSOL in combination with MATLAB was reduced by 60% compared to COMSOL alone. Consequently, the models could assist food producers and associations in designing packaging materials to prevent leakage of the packaging compound, developing new products and applications to improve product heating uniformity, and reducing the cost and time of the research and development stage.

Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe

2011 ◽  
Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano
Keyword(s):  
High Temperature ◽  
Heat Pipe ◽  
Thermal Flux ◽  
Anodic Bonding ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Pressure Gradients ◽  
Flux Method ◽  
Double Compression ◽  
Plastic Package

A novel two-port thermal flux method is implemented for degassing a microscale loop heat pipe (mLHP) and charging it with a working fluid. The mLHP is fabricated on a silicon wafer using standard MEMS micro-fabrication techniques, and capped by a Pyrex wafer, using anodic bonding. For these devices, small volumes and large capillary forces render conventional vacuum pump-based methods quite impractical. Instead, we employ thermally generated pressure gradients to purge non-condensible gases from the device, by vapor convection. Three different, high-temperature-compatible, MEMS device packaging techniques have been studied and implemented, in order to evaluate their effectiveness and reliability. The first approach uses O-rings in a mechanically sealed plastic package. The second approach uses an aluminum double compression fitting assembly for alignment, and soldering for establishing the chip-to-tube interconnects. The third approach uses a high temperature epoxy to hermetically embed the device in a machined plastic base package. Using water as the working fluid, degassing and filling experiments are conducted to verify the effectiveness of the thermal flux method.

Progression of damage caused by temperature cycling on a large die in a molded plastic package

2002 ◽  
Author(s):  
I.A. Lesk ◽  
R.E. Thomas ◽  
G. Hawkins ◽  
T.P. Remmel ◽  
J. Rugg
Keyword(s):  
Temperature Cycling ◽  
Plastic Package
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