In-Situ Tem Study of Copper-Tin Intermetallic Formation

1993 ◽  
Vol 323 ◽  
Author(s):  
Yujing Wu ◽  
Elizabeth G. Jacobs ◽  
Cyrus Pouraghabagher ◽  
Russell F. Pinizzotto
Keyword(s):  
Thin Films ◽  
Real Time ◽  
Diffusion Barrier ◽  
Solder Joints ◽  
Effective Diffusion ◽  
Copper Substrate ◽  
In Situ Tem ◽  
Intermetallic Formation ◽  
Intermetallic Growth

AbstractThe formation and growth of Cu6Sn5 and Cu3Sn at the interface of Sn-Pb solder/copper substrate are factors which affect the solderability and reliability of electronic solder joints. The addition of particles such as Ni to eutectic Sn-Pb solder drastically affects the activation energies of formation for both intermetallics. This study was performed to understand the mechanisms of intermetallic formation and the effects of Ni on intermetallic growth. Cu/Sn and Cu/Sn/Ni thin films were deposited by evaporation and observed in the TEM in real time using a hot stage. The diffusion of Sn through Cu6Sn5 and Cu3Sn followed by reaction with Cu must occur for intermetallic formation and growth to take place. Ni is an effective diffusion barrier which prevents Sn from diffusing into Cu.

Nanomechanical and in situ TEM characterization of boron carbide thin films on helium implanted substrates: Delamination, real-time cracking and substrate buckling

2015 ◽  
Vol 639 ◽  
pp. 54-64 ◽  
Author(s):  
David Framil Carpeño ◽  
Takahito Ohmura ◽  
Ling Zhang ◽  
Jérôme Leveneur ◽  
Michelle Dickinson ◽  
...  
Keyword(s):  
Thin Films ◽  
Boron Carbide ◽  
Real Time ◽  
In Situ Tem ◽  
Tem Characterization

Kinetics of Ion-Exchange Reactions in Hybrid Organic–Inorganic Perovskite Thin Films Studied by In Situ Real-Time X-ray Scattering

2018 ◽  
Vol 9 (23) ◽  
pp. 6750-6754 ◽  
Author(s):  
Alessandro Greco ◽  
Alexander Hinderhofer ◽  
M. Ibrahim Dar ◽  
Neha Arora ◽  
Jan Hagenlocher ◽  
...  
Keyword(s):  
Thin Films ◽  
Ion Exchange ◽  
Real Time ◽  
Exchange Reactions ◽  
Inorganic Perovskite ◽  
X Ray ◽  
X Ray Scattering ◽  
Kinetics Of ◽  
Kinetics Of Ion Exchange

In-Situ TEM Study of Plastic Stress Relaxation Mechanisms and Interface Effects in Metallic Films

2005 ◽  
Vol 875 ◽  
Author(s):  
Marc Legros ◽  
Gerhard Dehm ◽  
T. John Balk
Keyword(s):  
Thin Films ◽  
High Strength ◽  
Dislocation Motion ◽  
Dislocation Nucleation ◽  
Film Stress ◽  
In Situ Tem ◽  
Metallic Films ◽  
Cross Sectional ◽  
Thin Foils

AbstractTo investigate the origin of the high strength of thin films, in-situ cross-sectional TEM deformation experiments have been performed on several metallic films attached to rigid substrates. Thermal cycles, comparable to those performed using laser reflectometry, were applied to thin foils inside the TEM and dislocation motion was recorded dynamically on video. These observations can be directly compared to the current models of dislocation hardening in thin films. As expected, the role of interfaces is crucial, but, depending on their nature, they can attract or repel dislocations. When the film/interface holds off dislocations, experimental values of film stress match those predicted by the Nix-Freund model. In contrast, the attracting case leads to higher stresses that are not explained by this model. Two possible hardening scenarios are explored here. The first one assumes that the dislocation/interface attraction reduces dislocation mobility and thus increases the yield stress of the film. The second one focuses on the lack of dislocation nucleation processes in the case of attracting interfaces, even though a few sources have been observed in-situ.

An in-situ TEM microreactor for real-time nanomorphology & physicochemical parameters interrelated characterization

Nano Today ◽  
2020 ◽  
Vol 35 ◽  
pp. 100932
Author(s):  
Wei Li ◽  
Ming Li ◽  
Xueqing Wang ◽  
Pengcheng Xu ◽  
Haitao Yu ◽  
...  
Keyword(s):  
Real Time ◽  
Physicochemical Parameters ◽  
In Situ Tem

scholarly journals Quantitative In-Situ Nanoindentation of Thin Films in a Transmission Electron Microscope

2001 ◽  
Vol 7 (S2) ◽  
pp. 912-913
Author(s):  
A.M. Minorl ◽  
E.A. Stach ◽  
J.W. Morris
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Real Time ◽  
Silicon Substrates ◽  
Boron Doped Diamond ◽  
Boron Doped ◽  
Transmission Electron ◽  
Diamond Indenter ◽  
Force Calibration

A unique in situ nanoindentation stage has been built and developed at the National Center for Electron Microscopy in Berkeley, CA. By using piezoceramic actuators to finely position a 3-sided, boron-doped diamond indenter, we are able to image in real time the nanoindentation induced deformation of thin films. Recent work has included the force-calibration of the indenter, using silicon cantilevers to establish a relationship between the voltage applied to the piezoactuators, the displacement of the diamond tip, and the force generated.In this work, we present real time, in situ TEM observations of the plastic deformation of Al thin films grown on top of lithographically-prepared silicon substrates. The in situ nanoindentations require a unique sample geometry (see Figure 1) in which the indenter approaches the specimen normal to the electron beam. in order to meet this requirement, special wedge-shaped silicon samples were designed and microfabricated so that the tip of the wedge is sharp enough to be electron transparent.

scholarly journals In Situ TEM Study of Fatigue Crack Growth of Cu Thin Films Using a Modified Nanoindentation System

2016 ◽  
pp. 199-200
Author(s):  
Daniel Bufford ◽  
Douglas Stauffer ◽  
William Mook ◽  
S.A. Syed Asif ◽  
Brad Boyce ◽  
...  
Keyword(s):  
Thin Films ◽  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
In Situ Tem

Direct quantitative imaging of the writing stage in a photosensitive azopolymer by digital holography

Soft Matter ◽  
2019 ◽  
Vol 15 (39) ◽  
pp. 7809-7813 ◽  
Author(s):  
V. Pagliarulo ◽  
A. Calabuig ◽  
S. Grilli ◽  
P. Ferraro
Keyword(s):  
Thin Films ◽  
Real Time ◽  
Surface Relief ◽  
Digital Holography ◽  
Light Exposure ◽  
Quantitative Imaging ◽  
Continuous Light ◽  
Full Field ◽  
Surface Relief Grating

In this paper, we demonstrated that the gradual formation of a surface relief grating (SRG) in azopolymer thin films under continuous light exposure could be directly observed in situ and in real-time, allowing full-field characterization.

scholarly journals In situ TEM Studies of Ferroelectric Thin Films

2011 ◽  
Vol 17 (S2) ◽  
pp. 1362-1363
Author(s):  
P Gao ◽  
C Nelson ◽  
J Jokisaari ◽  
S Baek ◽  
C Eom ◽  
...  
Keyword(s):  
Thin Films ◽  
Ferroelectric Thin Films ◽  
In Situ Tem

Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.

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