High-density interconnect substrate with low thermal resistance for GaAs LSI multichip modules

1992 Proceedings 42nd Electronic Components & Technology Conference ◽

10.1109/ectc.1992.204324 ◽

2003 ◽

Cited By ~ 1

Author(s):

A. Miki ◽

M. Nishiguchi ◽

H. Nishizawa

Keyword(s):

Thermal Resistance ◽

High Density ◽

Multichip Modules

Download Full-text

Process and technology choices for manufacturing high density interconnections on silicon surstrates for multichip modules

12th International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1992.763422 ◽

2005 ◽

Author(s):

M.J. Davies ◽

E.A. Logan ◽

A.G. Munns ◽

D.J. Pedder

Keyword(s):

High Density ◽

Multichip Modules

Download Full-text

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

Journal of Low Temperature Physics ◽

10.1007/s10909-018-1930-3 ◽

2018 ◽

Vol 193 (3-4) ◽

pp. 578-584 ◽

Cited By ~ 3

Author(s):

Xavier de la Broïse ◽

Alain Le Coguie ◽

Jean-Luc Sauvageot ◽

Claude Pigot ◽

Xavier Coppolani ◽

...

Keyword(s):

Thermal Resistance ◽

Printed Circuit Board ◽

High Density ◽

Circuit Board ◽

Printed Circuit ◽

Flexible Printed Circuit ◽

High Thermal Resistance ◽

Very High

Download Full-text

The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.159875 ◽

1992 ◽

Vol 15 (4) ◽

pp. 465-477 ◽

Cited By ~ 13

Author(s):

G.-W. Pan ◽

J.A. Prentice ◽

S.K. Zahn ◽

A.J. Staniszewski ◽

W.L. Walters ◽

...

Keyword(s):

High Speed ◽

High Density ◽

Multichip Modules ◽

Single Chip

Download Full-text

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)

10.1109/icmcm.1998 ◽

1998 ◽

Keyword(s):

High Density ◽

Multichip Modules ◽

International Conference ◽

High Density Packaging

Download Full-text

High density interconnect verification of unpopulated multichip modules

[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.1991.279832 ◽

2002 ◽

Cited By ~ 13

Author(s):

O.C. Woodard

Keyword(s):

High Density ◽

Multichip Modules

Download Full-text

Fabrication of high density multichip modules

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.58860 ◽

1990 ◽

Vol 13 (3) ◽

pp. 565-569 ◽

Cited By ~ 9

Author(s):

J.J.H. Reche

Keyword(s):

High Density ◽

Multichip Modules

Download Full-text

An Overview of Multichip Module Technology for low Power Applications

MRS Proceedings ◽

10.1557/proc-264-3 ◽

1992 ◽

Vol 264 ◽

Author(s):

Chung W. Ho ◽

Sharon McAfee-Hunter

Keyword(s):

Thin Film ◽

Low Power ◽

Manufacturing Process ◽

High Performance ◽

Low Cost ◽

High Density ◽

Point Of View ◽

Multichip Module ◽

Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

Download Full-text