Pre-imidized photoimageable polyimide as a dielectric for high density multichip modules

1992 ◽  
Vol 32 (21) ◽  
pp. 1646-1652 ◽  
Author(s):  
Jay M. Cech ◽  
Andrew F. Burnett ◽  
Lisa Knapp
Keyword(s):  
High Density ◽  
Multichip Modules

The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules

1992 ◽  
Vol 15 (4) ◽  
pp. 465-477 ◽  
Author(s):  
G.-W. Pan ◽  
J.A. Prentice ◽  
S.K. Zahn ◽  
A.J. Staniszewski ◽  
W.L. Walters ◽  
...  
Keyword(s):  
High Speed ◽  
High Density ◽  
Multichip Modules ◽  
Single Chip

An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter
Keyword(s):  
Thin Film ◽  
Low Power ◽  
Manufacturing Process ◽  
High Performance ◽  
Low Cost ◽  
High Density ◽  
Point Of View ◽  
Multichip Module ◽  
Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

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