Heterogeneous Integration of Silicon and AlGaAs Micro-Ring Resonators by Transfer Printing

2018 ◽  
Author(s):  
C. Klitis ◽  
B. Guilhabert ◽  
J. McPhillimy ◽  
S. May ◽  
N. Zhang ◽  
...  
Keyword(s):  
Ring Resonators ◽  
Heterogeneous Integration ◽  
Transfer Printing

scholarly journals High-performance Acetone Soluble Tape Transfer Printing Method for Heterogeneous Integration

2019 ◽  
Vol 9 (1) ◽  
Author(s):  
Jiaqi Zhang ◽  
Yichang Wu ◽  
Zhe Li ◽  
Yachao Zhang ◽  
Yue Peng ◽  
...  
Keyword(s):  
Sapphire Substrate ◽  
High Performance ◽  
Water Soluble ◽  
Experimental Results ◽  
Heterogeneous Integration ◽  
Transfer Printing ◽  
Adhesion Promoter ◽  
Thermal Release ◽  
Printing Method

Abstract A high-performance transfer printing method using a new soluble tape which can be dissolved in acetone is proposed to be used in heterogeneous integration. Si inks array was transferred from SOI wafers onto various substrates without adhesion promoter by this new method which we refer to as the acetone soluble tape (AST) method to compare with other transfer printing methods by using thermal release tape (TRT), water soluble tape (WST) and polydimethylsiloxane (PDMS). By using the AST method, the transfer printing process does not involve interface contention between stamp/inks and inks/receiver substrate so that it maximizes the transfer printing efficiency. Experimental results present the AST method has good performances, and various alien substrates, even curvilinear surfaces, can be selected as receiver substrates by the AST method. To examine the quality of the transferred Si inks, the Si TFTs were fabricated by using the Si membrane transferred by the AST method on sapphire substrate and the devices show the good performance. All the results confirm that the AST method is an effective method in heterogeneous integration.

scholarly journals Heterogeneous Integration of Uni-Travelling-Carrier Photodiodes using Micro-Transfer-Printing on a Silicon-Nitride Platform

2021 ◽  
Author(s):  
Dennis Maes ◽  
Gunther Roelkens ◽  
Mohammed Zaknoune ◽  
Camiel Op de Beeck ◽  
Stijn Poelman ◽  
...  
Keyword(s):  
Silicon Nitride ◽  
Heterogeneous Integration ◽  
Transfer Printing

Nanoscale Transfer Printing for the Heterogeneous Integration of Semiconductor Nanowire Lasers

2019 ◽  
Author(s):  
Antonio Hurtado ◽  
Dimitars Jevtics ◽  
Benoit Guilhabert ◽  
Joshua Robertson ◽  
John McPhillimy ◽  
...  
Keyword(s):  
Heterogeneous Integration ◽  
Transfer Printing ◽  
Semiconductor Nanowire ◽  
Nanowire Lasers

scholarly journals Heterogeneous integration in silicon photonics through micro-transfer-printing

2019 ◽  
Author(s):  
Jing Zhang ◽  
Grigorij Muliuk ◽  
Jeroen Goyvaerts ◽  
Bahawal Haq ◽  
Sulakshna Kumari ◽  
...  
Keyword(s):  
Silicon Photonics ◽  
Heterogeneous Integration ◽  
Transfer Printing

scholarly journals Transfer-printing for heterogeneous integration

2019 ◽  
Author(s):  
B. Corbett ◽  
R. Loi ◽  
J. O’Callaghan ◽  
L. Liu ◽  
K. Thomas ◽  
...  
Keyword(s):  
Heterogeneous Integration ◽  
Transfer Printing

scholarly journals Laser-driven programmable non-contact transfer printing of objects onto arbitrary receivers via an active elastomeric microstructured stamp

2019 ◽  
Vol 7 (2) ◽  
pp. 296-304 ◽  
Author(s):  
Hongyu Luo ◽  
Chengjun Wang ◽  
Changhong Linghu ◽  
Kaixin Yu ◽  
Chao Wang ◽  
...  
Keyword(s):  
Metal Layer ◽  
Surface Membrane ◽  
Experimental Studies ◽  
Inorganic Materials ◽  
Heterogeneous Integration ◽  
Transfer Printing ◽  
Weak State ◽  
Patterned Surface ◽  
Micro Scale ◽  
Strong State

Abstract Transfer printing, as an important assembly technique, has attracted much attention due to its valuable merits to develop novel forms of electronics such as stretchable inorganic electronics requiring the heterogeneous integration of inorganic materials with soft elastomers. Here, we report on a laser-driven programmable non-contact transfer printing technique via a simple yet robust design of active elastomeric microstructured stamp that features cavities filled with air and embedded under the contacting surface, a micro-patterned surface membrane that encapsulates the air cavities and a metal layer on the inner-cavity surfaces serving as the laser-absorbing layer. The micro-patterned surface membrane can be inflated dynamically to control the interfacial adhesion, which can be switched from strong state to weak state by more than three orders of magnitude by local laser heating of the air in the cavity with a temperature increase below 100°C. Theoretical and experimental studies reveal the fundamental aspects of the design and fabrication of the active elastomeric microstructured stamp and the operation of non-contact transfer printing. Demonstrations in the programmable transfer printing of micro-scale silicon platelets and micro-scale LED chips onto various challenging receivers illustrate the extraordinary capabilities for deterministic assembly that are difficult to address by existing printing schemes, thereby creating engineering opportunities in areas requiring the heterogeneous integration of diverse materials such as curvilinear electronics and MicroLED displays.

Flexible and Scalable Heterogeneous Integration of GaN HEMTs on Si-CMOS by Micro-Transfer-Printing

2017 ◽  
Vol 215 (8) ◽  
pp. 1700556 ◽  
Author(s):  
Ralf Lerner ◽  
Stefan Eisenbrandt ◽  
Frank Fischer ◽  
Alin Fecioru ◽  
António Jośe Trindade ◽  
...  
Keyword(s):  
Heterogeneous Integration ◽  
Transfer Printing ◽  
Gan Hemts
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