Screen-printed free-standing piezoelectric devices using low temperature process

2015 ◽  
Author(s):  
Nursabirah Jamel ◽  
Ahmed Almusallam ◽  
Dibin Zhu ◽  
Russel Torah ◽  
Kai Yang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Free Standing ◽  
Piezoelectric Devices ◽  
Low Temperature Process ◽  
Screen Printed

Soldering and Brazing Metals to Ceramics at Room Temperature Using a Novel Nanotechnology

2006 ◽  
Vol 45 ◽  
pp. 1578-1587 ◽  
Author(s):  
A. Duckham ◽  
J. Levin ◽  
T.P. Weihs
Keyword(s):  
Low Temperature ◽  
Room Temperature ◽  
Thermal Stresses ◽  
Local Heat ◽  
Bonding Process ◽  
Free Standing ◽  
Multilayer Foils ◽  
Heats Of Mixing ◽  
Reactive Foils ◽  
Low Temperature Process

This paper reviews a new, low-temperature process for soldering and brazing ceramics to metals that is based on the use of reactive multilayer foils as a local heat source. The reactive foils range in thickness from 40μm to 100μm and contain many nanoscale layers that alternate between materials with large heats of mixing, such as Al and Ni. By inserting a free-standing foil between two solder (or braze) layers and two components, heat generated by the reaction of the foil melts the solder (or braze) and consequently bonds the components. The use of reactive foils eliminates the need for a furnace, and dramatically reduces the heating of the components being bonded. Thus ceramics and metals can be joined over large areas without the damaging thermal stresses that are typically encountered when cooling in furnace soldering or brazing operations. This paper draws on earlier work to review the bonding process and its application to a variety of ceramic-metal systems. Predictions of thermal profiles during bonding and the resulting residual stresses are described and compared with results for conventional soldering or brazing processes. The microstructure, uniformity, and physical properties of the reactive foil bonds are reviewed as well, using several different ceramic-metal systems as examples.

Integrated low-temperature process for the fabrication of amorphous Si nanoparticles embedded in Al2 O3 for non-volatile memory application

2016 ◽  
Vol 213 (9) ◽  
pp. 2446-2451 ◽  
Author(s):  
Klemens Ilse ◽  
Thomas Schneider ◽  
Johannes Ziegler ◽  
Alexander Sprafke ◽  
Ralf B. Wehrspohn
Keyword(s):  
Low Temperature ◽  
Si Nanoparticles ◽  
Non Volatile Memory ◽  
Amorphous Si ◽  
Volatile Memory ◽  
Low Temperature Process

Low temperature process to create brick

2008 ◽  
Vol 22 (6) ◽  
pp. 1114-1121 ◽  
Author(s):  
Mouhamadou Bassir Diop ◽  
Michael W. Grutzeck
Keyword(s):  
Low Temperature ◽  
Low Temperature Process

GaAs heteroepitaxy on an epitaxial Si surface with a low‐temperature process

1993 ◽  
Vol 63 (14) ◽  
pp. 1963-1965 ◽  
Author(s):  
Hidefumi Mori ◽  
Masami Tachikawa ◽  
Mitsuru Sugo ◽  
Yoshio Itoh
Keyword(s):  
Low Temperature ◽  
Low Temperature Process

scholarly journals NEW TECHNOLOGY FOR HARDENING READY-MADE TOOLS IN AQUAEOUS DISPERSED MEDIA

2017 ◽  
Vol 23 (1) ◽  
pp. 87
Author(s):  
Alexander A. Shmatov ◽  
Ľubomír Šooš ◽  
Zdenko Krajný
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Solid Lubricant ◽  
New Technology ◽  
Aqueous Media ◽  
Hard Alloys ◽  
Refractory Materials ◽  
Structure And Properties ◽  
Refractory Compounds ◽  
Low Temperature Process

<p class="AMSmaintext"><span lang="EN-US">The new method for hardening ready-made steels, hard alloys and diamond tools is developed: low-temperature process for producing thin-film solid lubricant coatings by hydro chemical treatment in specially prepared aqueous media of nanosized hard refractory compounds and subsequent tempering. The main advantages of the method over known processes are presented. The principles for dispersion of refractory materials are formulated. The structure and properties of the obtained coatings are examined. <br /></span></p>

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