On-line testing of transient faults affecting functional blocks of FCMOS, domino and FPGA-implemented self-checking circuits

2003 ◽  
Author(s):  
C. Metra ◽  
S. Di Francescantonio ◽  
G. Marrale
Keyword(s):  
Transient Faults ◽  
On Line ◽  
Functional Blocks

scholarly journals Signal Coding and CMOS Gates for Combinational Functional Blocks of Very Deep Submicron Self-checking Circuits

VLSI Design ◽  
2000 ◽  
Vol 11 (1) ◽  
pp. 23-34 ◽  
Author(s):  
Cecilia Metra ◽  
Michele Favalli ◽  
Bruno Riccò
Keyword(s):  
Deep Submicron ◽  
Transient Faults ◽  
Next Generation ◽  
Electrical Parameters ◽  
Parameter Variations ◽  
Increased Sensitivity ◽  
Functional Blocks ◽  
Internal Faults ◽  
Signal Coding

In this paper we propose signal coding and CMOS gates that are suitable to self-checking circuits with combinational functional blocks implemented also by next generation, very deep submicron technology. In particular, our functional blocks satisfy the Strongly Fault-Secure property with respect to a wide set of possible, internal faults including not only conventional stuck-ats, but also transistor stuck-ons, transistor stuck-opens, resistive bridgings, delays, crosstalks and transient faults, that are very likely to affect next generation ICs. Compared to alternative, existing solutions, that proposed here does not imply any critical constraint on the circuit electrical parameters. Therefore, it is suitable to be adopted to design very deep submicron self-checking circuits which, compared to todays' circuits, will present significantly increased sensitivity to parameter variations occurring during fabrication.

Fault-Tolerant and Fail-Safe Design Based on Reconfiguration

2011 ◽  
pp. 175-194 ◽  
Author(s):  
Hana Kubatova ◽  
Pavel Kubalik
Keyword(s):  
Fault Detection ◽  
High Probability ◽  
Fault Tolerant ◽  
Main Property ◽  
Transient Faults ◽  
Trade Off ◽  
Reliability Models ◽  
On Line ◽  
Mission Critical ◽  
Fail Safe

The main aim of this chapter is to present the way, how to design fault-tolerant or fail-safe systems in programmable hardware (FPGAs) and therefore to use FPGAs in mission-critical applications, too. RAM based FPGAs are usually taken for unreliable due to high probability of transient faults (SEU) and therefore inapplicable in this area. But FPGAs can be easily reconfigured. The authors’ aim is to utilize appropriate type of FPGA reconfiguration and to combine it with well-known methods for fail-safe and fault-tolerant design (duplex, TMR) including on-line testing methods for fault detection and then startup of the reconfiguration process. Dependability parameters’ calculations based on reliability models is integral part of proposed methodology. The trade-off between the requested level of dependability characteristics of a designed system and area overhead with respect to FPGA possible faults the main property and advantage of proposed methodology.

Fault-Tolerant and Fail-Safe Design based on Reconfiguration

2013 ◽  
pp. 695-714
Author(s):  
Hana Kubatova ◽  
Pavel Kubalik
Keyword(s):  
Fault Detection ◽  
High Probability ◽  
Fault Tolerant ◽  
Main Property ◽  
Transient Faults ◽  
Trade Off ◽  
Reliability Models ◽  
On Line ◽  
Mission Critical ◽  
Fail Safe

The main aim of this chapter is to present the way, how to design fault-tolerant or fail-safe systems in programmable hardware (FPGAs) and therefore to use FPGAs in mission-critical applications, too. RAM based FPGAs are usually taken for unreliable due to high probability of transient faults (SEU) and therefore inapplicable in this area. But FPGAs can be easily reconfigured. The authors’ aim is to utilize appropriate type of FPGA reconfiguration and to combine it with well-known methods for fail-safe and fault-tolerant design (duplex, TMR) including on-line testing methods for fault detection and then startup of the reconfiguration process. Dependability parameters’ calculations based on reliability models is integral part of proposed methodology. The trade-off between the requested level of dependability characteristics of a designed system and area overhead with respect to FPGA possible faults the main property and advantage of proposed methodology.

The on-line use of histogram data for high-speed correction and alignment of electron microscope images

1984 ◽  
Vol 42 ◽  
pp. 556-557
Author(s):  
William Krakow
Keyword(s):  
Power Spectrum ◽  
High Speed ◽  
Direct Memory Access ◽  
Digital Television ◽  
Contrast Transfer Function ◽  
The Past ◽  
High Resolution Tem ◽  
On Line ◽  
Correction Of Astigmatism ◽  
The Fourier Transform

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.

Image registration with a computer driven S.T.E.M.

1978 ◽  
Vol 36 (1) ◽  
pp. 98-99
Author(s):  
A.M.H. Schepman ◽  
J.A.P. van der Voort ◽  
J.E. Mellema
Keyword(s):  
Spot Size ◽  
Scanning Transmission Electron Microscope ◽  
Small Computer ◽  
Structural Studies ◽  
Area Of Interest ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Specimen Area ◽  
On Line ◽  
Minimum Distances

A Scanning Transmission Electron Microscope (STEM) was coupled to a small computer. The system (see Fig. 1) has been built using a Philips EM400, equipped with a scanning attachment and a DEC PDP11/34 computer with 34K memory. The gun (Fig. 2) consists of a continuously renewed tip of radius 0.2 to 0.4 μm of a tungsten wire heated just below its melting point by a focussed laser beam (1). On-line operation procedures were developped aiming at the reduction of the amount of radiation of the specimen area of interest, while selecting the various imaging parameters and upon registration of the information content. Whereas the theoretical limiting spot size is 0.75 nm (2), routine resolution checks showed minimum distances in the order 1.2 to 1.5 nm between corresponding intensity maxima in successive scans. This value is sufficient for structural studies of regular biological material to test the performance of STEM over high resolution CTEM.

Design and calibration of an IVEM for general 3-dimensional imaging of non-diffracting materials

1992 ◽  
Vol 50 (2) ◽  
pp. 1040-1041
Author(s):  
Neil Rowlands ◽  
Jeff Price ◽  
Michael Kersker ◽  
Seichi Suzuki ◽  
Steve Young ◽  
...  
Keyword(s):  
3D Imaging ◽  
Tomographic Reconstruction ◽  
Three Dimensional ◽  
3 Dimensional ◽  
3D Microstructure ◽  
Image Translation ◽  
Digital Correlation ◽  
On Line ◽  
Mechanical Stage ◽  
Projection Angle

Three-dimensional (3D) microstructure visualization on the electron microscope requires that the sample be tilted to different positions to collect a series of projections. This tilting should be performed rapidly for on-line stereo viewing and precisely for off-line tomographic reconstruction. Usually a projection series is collected using mechanical stage tilt alone. The stereo pairs must be viewed off-line and the 60 to 120 tomographic projections must be aligned with fiduciary markers or digital correlation methods. The delay in viewing stereo pairs and the alignment problems in tomographic reconstruction could be eliminated or improved by tilting the beam if such tilt could be accomplished without image translation.A microscope capable of beam tilt with simultaneous image shift to eliminate tilt-induced translation has been investigated for 3D imaging of thick (1 μm) biologic specimens. By tilting the beam above and through the specimen and bringing it back below the specimen, a brightfield image with a projection angle corresponding to the beam tilt angle can be recorded (Fig. 1a).

Software pattern recognition applied to nanodiffraction patterns from a STEM instrument

1986 ◽  
Vol 44 ◽  
pp. 694-695
Author(s):  
G.Y. Fan ◽  
J.M. Cowley
Keyword(s):  
Image Processing ◽  
Pattern Recognition ◽  
Computer Software ◽  
Processing System ◽  
Light Level ◽  
Host Computer ◽  
Low Light ◽  
Image Processing System ◽  
Recent Developments ◽  
On Line

In recent developments, the ASU HB5 has been modified so that the timing, positioning, and scanning of the finely focused electron probe can be entirely controlled by a host computer. This made the asynchronized handshake possible between the HB5 STEM and the image processing system which consists of host computer (PDP 11/34), DeAnza image processor (IP 5000) which is interfaced with a low-light level TV camera, array processor (AP 400) and various peripheral devices. This greatly facilitates the pattern recognition technique initiated by Monosmith and Cowley. Software called NANHB5 is under development which, instead of employing a set of photo-diodes to detect strong spots on a TV screen, uses various software techniques including on-line fast Fourier transform (FFT) to recognize patterns of greater complexity, taking advantage of the sophistication of our image processing system and the flexibility of computer software.

Thickness Measurement in the AEM by Macintosh-Based Analysis of Two-Beam Convergent Beam Patterns

1990 ◽  
Vol 48 (2) ◽  
pp. 504-505
Author(s):  
John F. Mansfield ◽  
Douglas C. Crawford
Keyword(s):  
Electron Microscope ◽  
Video Camera ◽  
Thickness Measurement ◽  
Specimen Thickness ◽  
Crystalline Materials ◽  
Beam Dynamic ◽  
Line Measurement ◽  
On Line ◽  
Image Position ◽  
Convergent Beam

A method has been developed that allows on-line measurement of the thickness of crystalline materials in the analytical electron microscope. Two-beam convergent beam electron diffraction (CBED) patterns are digitized from a JEOL 2000FX electron microscope into an Apple Macintosh II microcomputer via a Gatan #673 CCD Video Camera and an Imaging Systems Technology Video 1000 frame-capture board. It is necessary to know the lattice parameters of the sample since measurements are made of the spacing of the diffraction discs in order to calibrate the pattern. The sample thickness is calculated from measurements of the spacings of the fringes that are seen in the diffraction discs. This technique was pioneered by Kelly et al, who used the two-beam dynamic theory of MacGillavry relate the deviation parameter (Si) of the ith fringe from the exact Bragg condition to the specimen thickness (t) with the equation:Where ξg, is the extinction distance for that reflection and ni is an integer.

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