A new high power device of GaN HEMTs on Si substrate with lateral heat dissipation packaging

2012 ◽  
Author(s):  
Hsin-Ping Chou ◽  
Chung-Hsiang Ho ◽  
Yung-Jen Cheng ◽  
Po-Chien Chou ◽  
Stone Cheng
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Power Device ◽  
Si Substrate ◽  
Gan Hemts ◽  
Lateral Heat

Enhanced lateral heat dissipation packaging structure for GaN HEMTs on Si substrate

2013 ◽  
Vol 51 (1-2) ◽  
pp. 20-24 ◽  
Author(s):  
Stone Cheng ◽  
Po-Chien Chou ◽  
Wei-Hua Chieng ◽  
E.Y. Chang
Keyword(s):  
Heat Dissipation ◽  
Si Substrate ◽  
Gan Hemts ◽  
Packaging Structure ◽  
Lateral Heat

Measurement of Bonding Stress in Silicon High Power Device Structures by Infrared Photoelasticity Method

1999 ◽  
Vol 563 ◽  
Author(s):  
H. J. Peng ◽  
S. P. Wong ◽  
W. F. Lau ◽  
N. Ke ◽  
Shounan Zhao
Keyword(s):  
High Power ◽  
Quantitative Information ◽  
Bonding Process ◽  
Power Device ◽  
Geometrical Parameters ◽  
Interlaminar Stresses ◽  
Si Substrate ◽  
Power Devices ◽  
Si Substrates ◽  
Device Structures

AbstractSilicon high-power devices are commonly bonded to Mo electrodes using Al films. Bonding stress will inevitably be introduced into the Si substrate by such a process. In this work, the infrared (IR) photoelasticity (PE) method was employed to measure the stress distribution in the Si substrates induced by high temperature bonding process of Si/Al/Mo structures commonly used in the production of silicon thyristors. It is demonstrated that quantitative information on both the directions and magnitudes of the stress can be obtained. The dependence of the magnitude of the stress on the geometrical parameters of the structure has also been studied. The experimental results are shown to agree well with the calculated results derived from a theory of interlaminar stresses in composites.

Experimental Demonstration of Thermal Management of High-Power GaN Transistors with Graphene Lateral Heat Spreaders

2011 ◽  
Vol 1344 ◽  
Author(s):  
Zhong Yan ◽  
Guanxiong Liu ◽  
Javed Khan ◽  
Jie Yu ◽  
Samia Subrina ◽  
...  
Keyword(s):  
Thermal Management ◽  
High Power ◽  
Heat Dissipation ◽  
Local Temperature ◽  
Heat Spreader ◽  
Heat Spreaders ◽  
Device Structures ◽  
Graphene Flakes ◽  
Lateral Heat

ABSTRACTGraphene is a promising candidate material for thermal management of high-power electronics owing to its high intrinsic thermal conductivity. Here we report preliminary results of the proof-of-concept demonstration of graphene lateral heat spreaders. Graphene flakes were transferred on top of GaN devices through the mechanical exfoliation method. The temperature rise in the GaN device channels was monitored in-situ using micro-Raman spectroscopy. The local temperature was measured from the shift in the Raman peak positions. By comparing Raman spectra of GaN devices with and without graphene heat spreader, we demonstrated that graphene lateral heat spreaders effectively reduced the local temperature by ~ 20oC for a given dissipated power density. Numerical simulation of heat dissipation in the considered device structures gave results consistent with the experimental data.

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

scholarly journals Electromagnetic Field Analysis and Design of a Hermetic Interior Permanent Magnet Synchronous Motor with Helical-Grooved Self-Cooling Case for Unmanned Aerial Vehicles

2021 ◽  
Vol 11 (11) ◽  
pp. 4856
Author(s):  
Hae-Sol Lee ◽  
Myeong-Hwan Hwang ◽  
Hyun-Rok Cha
Keyword(s):  
Electromagnetic Field ◽  
Unmanned Aerial Vehicles ◽  
Permanent Magnet ◽  
High Power ◽  
Heat Dissipation ◽  
Power Source ◽  
Flight Duration ◽  
Aerial Vehicles ◽  
Drive Motor ◽  
Interior Permanent Magnet

As unmanned aerial vehicles expand their utilization and coverage, research is in progress to develop low-weight and high-performance motors to efficiently carry out various missions. An electromagnetic field interior permanent magnet (IPM) motor was designed and analyzed in this study that improved the flight performance and flight duration of an unmanned aerial vehicle (UAV). The output power and efficiency of a conventional commercial UAV motor were improved by designing an IPM motor of the same size, providing high power output and high-speed operation by securing high power density, wide speed range, and mechanical stiffness. The cooling performance and efficiency of the drive motor were improved without requiring a separate power source for cooling by introducing the helical-grooved self-cooling case, which has a low heat generation structure. Furthermore, the motor is oil-cooled through rotating power without a separate power source, reducing the weight of the UAV. The heat dissipation characteristics were verified by fabricating a prototype and taking actual measurements to verify the validity of the heat dissipation characteristics. The results of this study are expected to improve the flight duration and performance of UAVs and contribute to the efficiency of the design of a UAV drive motor.

Electron-beam valves (EBVs): a new type of high-power device

2000 ◽  
Author(s):  
Vladimir I. Perevodchikov ◽  
V. N. Shapenko ◽  
V. F. Martynov ◽  
P. M. Stalkov ◽  
A. L. Shapiro
Keyword(s):  
Electron Beam ◽  
High Power ◽  
Power Device ◽  
New Type

scholarly journals Figures of merit in high-frequency and high-power GaN HEMTs

2009 ◽  
Vol 193 ◽  
pp. 012040 ◽  
Author(s):  
F A Marino ◽  
N Faralli ◽  
D K Ferry ◽  
S M Goodnick ◽  
M Saraniti
Keyword(s):  
High Power ◽  
High Frequency ◽  
Figures Of Merit ◽  
Gan Hemts

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

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