IMPROVE simulation tool: Integrating heterogeneous simulation modules for semiconductor manufacturing processes

2012 ◽  
Author(s):  
N. Almeida ◽  
J. Pires ◽  
D. Sora
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing Processes ◽  
Simulation Tool

Petri-net based scheduling strategy for semiconductor manufacturing processes

2011 ◽  
Vol 89 (3) ◽  
pp. 291-300 ◽  
Author(s):  
Yin-Hsuan Lee ◽  
Chuei-Tin Chang ◽  
David Shan-Hill Wong ◽  
Shi-Shang Jang
Keyword(s):  
Petri Net ◽  
Semiconductor Manufacturing ◽  
Manufacturing Processes ◽  
Scheduling Strategy

Ultra-thin glasses for semiconductor packaging

2016 ◽  
Vol 2016 (1) ◽  
pp. 000293-000298
Author(s):  
Ruediger Sprengard ◽  
Matthias Jotz ◽  
Martin Letz ◽  
Lutz Parthier ◽  
Fredrik Prince ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Laser Ablation ◽  
Semiconductor Manufacturing ◽  
Mechanical Stability ◽  
Manufacturing Processes ◽  
Position Accuracy ◽  
Semiconductor Packaging ◽  
Thick Glass

Abstract Glasses are homogeneous, many glasses have excellent dielectric properties at GHz frequencies and some have thermal expansions (CTE) which are close to silicon. Ultrathin glasses (UTG) with thicknesses of 25 μm to 200 μm (0.001 to 0.0079 inch) offer numerous options for packaging, integration and co-processing in semiconductor manufacturing processes. We introduce SCHOTT UTG including paths to further improve their mechanical stability and strength. We use laser ablation in 50μm thick glass and show via fabrication with a potential of mass manufacturing with via diameters of 30μm, 38μm pitch and a position accuracy of +/− 1μm. The structures are metallized using sputtering and electroplating which leads to hermetic, tight conducting through glass-vias (TGV).

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