scholarly journals Vectorial waveguide reflectometer for dielectric characterization of materials under power microwaves

Author(s):  
J.J. Mallorqui ◽  
A. Aguasca ◽  
S. Ribo
2019 ◽  
Vol 10 (1) ◽  
Author(s):  
Blanka Škipina ◽  
Adriaan S. Luyt ◽  
Duško Dudić

Dielectric characterization of materials in the RF domain is usually carried out on samples with applied electroconductive electrodes. A high-quality contact between a sample and the measuring electrodes provides a stable current flow through the sample and information on the exact value of the electric field in which the sample is located. It also enables a simple measuring instrument to determine the dielectric parameters of the material being tested. However, the presence of contact potentials and the exchange of charge between the test material and the applied electrodes can mask some electrical phenomena in the material or significantly affect how we perceive these phenomena. In order to detect weak electrical processes in the material, for example the photoelectric response of non-polar polymers, contactless dielectric measurements must be carried out. The literature on non-contact dielectric measurements in the RF domain is poor, and because of that, this paper presents the methodology for determining the dielectric parameters of film-shaped materials in conditions of contactless dielectric measurements.


2021 ◽  
Vol 7 (7) ◽  
pp. 75176-75188
Author(s):  
Marcelo da Silva Matias ◽  
Luis Alberto Rabanal Ramirez

This paper presents the main techniques of electromagnetic characterization electromagnetic at microwave frequency. A detailed analysis of these is performed, indicating which materials under test (MUT) can be measured with the specific technique. Additionally, for the dielectric characterization, measurement results are presented with the best technique that suits this case.


Author(s):  
Simon Thomas

Trends in the technology development of very large scale integrated circuits (VLSI) have been in the direction of higher density of components with smaller dimensions. The scaling down of device dimensions has been not only laterally but also in depth. Such efforts in miniaturization bring with them new developments in materials and processing. Successful implementation of these efforts is, to a large extent, dependent on the proper understanding of the material properties, process technologies and reliability issues, through adequate analytical studies. The analytical instrumentation technology has, fortunately, kept pace with the basic requirements of devices with lateral dimensions in the micron/ submicron range and depths of the order of nonometers. Often, newer analytical techniques have emerged or the more conventional techniques have been adapted to meet the more stringent requirements. As such, a variety of analytical techniques are available today to aid an analyst in the efforts of VLSI process evaluation. Generally such analytical efforts are divided into the characterization of materials, evaluation of processing steps and the analysis of failures.


Author(s):  
R.T. Blackham ◽  
J.J. Haugh ◽  
C.W. Hughes ◽  
M.G. Burke

Essential to the characterization of materials using analytical electron microscopy (AEM) techniques is the specimen itself. Without suitable samples, detailed microstructural analysis is not possible. Ultramicrotomy, or diamond knife sectioning, is a well-known mechanical specimen preparation technique which has been gaining attention in the materials science area. Malis and co-workers and Glanvill have demonstrated the usefulness and applicability of this technique to the study of a wide variety of materials including Al alloys, composites, and semiconductors. Ultramicrotomed specimens have uniform thickness with relatively large electron-transparent areas which are suitable for AEM anaysis.Interface Analysis in Type 316 Austenitic Stainless Steel: STEM-EDS microanalysis of grain boundaries in austenitic stainless steels provides important information concerning the development of Cr-depleted zones which accompany M23C6 precipitation, and documentation of radiation induced segregation (RIS). Conventional methods of TEM sample preparation are suitable for the evaluation of thermally induced segregation, but neutron irradiated samples present a variety of problems in both the preparation and in the AEM analysis, in addition to the handling hazard.


1998 ◽  
Vol 08 (PR9) ◽  
pp. Pr9-113-Pr9-116 ◽  
Author(s):  
C. M. Weil ◽  
R. G. Geyer ◽  
L. Sengupta

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